Thermal properties of new Bismaleimide resins containing hydrogen silsesquioxane and diallyl bisphenol A

摘要

Bismaleimide (BMI) resins modified with hydrogen silsesquioxane (HSQ) and diallyl bisphenol A (DABPA) (BMI-HSQ-DABPA resins) were prepared. DSC, FTIR, and TGA were used to characterize the curing behaviors, structures, and thermal properties of the BMI-HSQ-DABPA resins, respectively. The results showed that the glass transition temperatures and thermal stabilities of the cured BMI-HSQ-DABPA resins increased with the rise of the contents of HSQ.