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Comparative study of protective nickel-tungsten deposit behavior obtained by continuous and pulsed currents from citrate-ammonia media

机译:柠檬酸-氨介质中连续和脉冲电流获得的保护性镍钨沉积行为的比较研究

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摘要

A comparative study of protective Ni-W deposit behavior obtained by continuous (cc) and pulsed (pc) currents from citrate-ammonia media on copper surface was presented. Effects of electroplating process on microstructures, in terms of crystallization, proportion and grain size were investigated using SEM/EDS and XRD. The results show that Ni-W morphology obtained by (cc) and (pc) was quite different; it changed from rigorous and irregular to smooth and granulate. Corrosion mechanisms and stability in 10. h of immersion into 3% NaCl of various treated-coatings were discussed in the consideration of electrical conductivity, microhardness, porosity and inhibition efficiency.
机译:提出了通过柠檬酸-氨介质在铜表面上连续(cc)和脉冲(pc)电流获得的保护性Ni-W沉积行为的比较研究。使用SEM / EDS和XRD研究了电镀工艺对微观结构的影响,包括结晶度,比例和晶粒尺寸。结果表明,通过(cc)和(pc)获得的Ni-W形态有很大的不同。它从严格和不规则变为光滑和颗粒状。考虑到电导率,显微硬度,孔隙率和抑制效率,讨论了各种处理过的涂层在3%NaCl中浸泡10小时后的腐蚀机理和稳定性。

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