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首页> 外文期刊>Langmuir: The ACS Journal of Surfaces and Colloids >Synthesis of Metal-Semiconductor Core-Shell Nanoparticles Using Electrochemical Surface-Limited Reactions
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Synthesis of Metal-Semiconductor Core-Shell Nanoparticles Using Electrochemical Surface-Limited Reactions

机译:电化学表面有限反应合成金属半导体核壳纳米粒子

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摘要

We report the synthesis of Au/CuI and Au/CdS core-shell nanoparticle (NP) thin films using codeposition and electrochemical atomic layer deposition (EC-ALD). Au nanoparticle films were prepared on glassy carbon supports by depositing alternating layers of poly(diallyl dimethylammonium)-stabilized Au nanoparticles and COP(2)W(17)O(61)(8-)polyoxometallate interlayers. From there, CuI was deposited onto the Surface of Au nanoparticles using electrochemical atomic layer deposition, while US films were grown by an atom-by-atom codeposition method. The semiconductor-Au core-shell nanoparticles were characterized by electrochemistry, photoluminescence spectroscopy, and Raman spectroscopy. Our results indicate that the semiconductors deposit onto the AuNP surface by surface limited electrochemical reactions.
机译:我们报告使用共沉积和电化学原子层沉积(EC-ALD)的Au / CuI和Au / CdS核壳纳米粒子(NP)薄膜的合成。通过沉积聚(二烯丙基二甲基铵)稳定的金纳米颗粒和COP(2)W(17)O(61)(8-)多金属氧酸盐中间层的交替层,在玻璃碳载体上制备Au纳米颗粒薄膜。从那里开始,使用电化学原子层沉积将CuI沉积到Au纳米颗粒的表面上,而US膜通过逐原子共沉积方法生长。通过电化学,光致发光光谱和拉曼光谱对半导体-Au核-壳纳米颗粒进行了表征。我们的结果表明,半导体通过表面受限的电化学反应沉积在AuNP表面上。

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