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Calibrated complex impedance and permittivity measurements with scanning microwave microscopy

机译:使用扫描微波显微镜对复数阻抗和介电常数进行校准测量

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We present a procedure for calibrated complex impedance measurements and dielectric quantification with scanning microwave microscopy. The calibration procedure works in situ directly on the substrate with the specimen of interest and does not require any specific calibration sample. In the workflow tip-sample approach curves are used to extract calibrated complex impedance values and to convert measured S_(11) reflection signals into sample capacitance and resistance images. The dielectric constant of thin dielectric SiO_2 films were determined from the capacitance images and approach curves using appropriate electrical tip-sample models and the ε_r value extracted at f = 19.81 GHz is in good agreement with the nominal value of ε_r ~ 4. The capacitive and resistive material properties of a doped Si semiconductor sample were studied at different doping densities and tip-sample bias voltages. Following a simple serial model the capacitance-voltage spectroscopy curves are clearly related to the semiconductor depletion zone while the resistivity is rising with falling dopant density from 20 Ω to 20 kΩ. The proposed procedure of calibrated complex impedance measurements is simple and fast and the accuracy of the results is not affected by varying stray capacitances. It works for nanoscale samples on either fully dielectric or highly conductive substrates at frequencies between 1 and 20 GHz.
机译:我们提出了利用扫描微波显微镜对复数阻抗测量和介电定量进行校准的程序。校准程序直接在感兴趣的样品上直接在基板上进行,不需要任何特定的校准样品。在工作流中,尖端采样方法曲线用于提取校准的复阻抗值,并将测得的S_(11)反射信号转换为采样电容和电阻图像。 SiO_2薄膜介质的介电常数由电容图像和进近曲线确定,采用合适的电子尖端采样模型,在f = 19.81 GHz处提取的ε_r值与ε_r〜4的标称值非常吻合。在不同的掺杂密度和尖端样品偏压下研究了掺杂的硅半导体样品的电阻材料性能。按照简单的串行模型,电容-电压光谱曲线显然与半导体耗尽区相关,而电阻率随掺杂剂密度从20Ω下降至20kΩ而升高。所提出的校准复数阻抗测量的程序简单,快速,并且结果的准确性不受杂散电容变化的影响。它适用于在1到20 GHz之间的频率下在完全绝缘或高导电衬底上的纳米级样品。

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