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A mechanism for the addition of ethylene to nickel bis-dithiolene

机译:向双二硫代镍镍中添加乙烯的机理

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Density functional theory calculations predict a new lower energy route for the formation of the desired interligand addition product from the reaction between ethylene and nickel bis(dithiolene). The new route involves the initial binding of ethylene along the nickel-sulfur bond. The barrier heights for adding ethylene along this bond for the neutral and anionic nickel complexes are compared to each other as well as to a previously published previous mechanism. Selected structural parameters of the studied species have been analyzed to highlight the structural change on specific reactions. It was found that the ethyleneickel bis-dithiolene reaction occurs preferably via the nickel-sulfur bond of the neutral species, forming a complex which then rearranges to a desired interligand adduct via a low barrier.
机译:密度泛函理论计算为乙烯和双(二硫代镍)镍反应形成所需的配体加成产物预测了一条新的较低能路线。新路线涉及乙烯沿镍-硫键的初始结合。将中性和阴离子镍配合物沿着该键添加乙烯的势垒高度相互比较,并与以前发布的先前机理进行了比较。分析了所研究物种的选定结构参数,以突出特定反应的结构变化。已经发现,乙烯/镍双-二硫代烯烃反应优选通过中性物质的镍-硫键发生,形成络合物,然后该络合物通过低势垒重排成所需的配体加合物。

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