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Selective insulation with poly(tetrafluoroethylene) of substrate electrodes for electrochemical background. reduction in scanning electrochemical microscopy

机译:与聚四氟乙烯基板电极的选择性绝缘,用于电化学背景。减少扫描电化学显微镜

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摘要

We describe a wet process for the fabrication of poly(tetrafluoroethylene) (PTFE)-covered electrodes in which arrays of holes (similar to 200 mu m) are formed. The PTFE coating provides electrical insulation of most of the electrode surface with selected regions exposed for electrochemical experiments. The arrays of microholes can be controllably patterned and filled with precursor solutions using a piezoelectric dispenser. A micrometer spot of electrocatalyst is produced after reduction of the precursor. The application is tested for scanning electrochemical microscopy (SECM) in the tip generation-substrate collection (TG-SC) studies of electrocatalysts. The method is shown to reduce the substrate background currents that are included in the electrochemical signal read from the local perturbation induced with the SECM tip to the substrate in the TG-SC mode of SECK Ibis background current reduction is consistent with the decrease in the exposed area of the electrode. The general methodology for the fabrication of the substrate electrodes and two proof-of-concept applications in the TG-SC SECM modality are described.
机译:我们描述了一种湿法工艺,该工艺用于制造覆盖有聚四氟乙烯(PTFE)的电极,在该电极中形成了多个孔阵列(类似于200微米)。 PTFE涂层可为大部分电极表面提供电绝缘,并露出选定区域以进行电化学实验。可以使用压电分配器可控地对微孔阵列进行图案化并填充前体溶液。前体还原后会产生一微米的电催化剂斑点。在电子催化剂的尖端生成-底物收集(TG-SC)研究中,对该应用程序进行了扫描电化学显微镜(SECM)测试。结果表明,该方法可减少包含在电化学信号中的底物背景电流,该电化学信号从SECM尖端以SECK的TG-SC模式引起的局部扰动读取到底物,Ibis背景电流的减少与暴露在外的减少是一致的电极的面积。描述了在TG-SC SECM模式中制造衬底电极和两种概念验证应用的一般方法。

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