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The Use of 'INTROMET' Device for the Quality Inspection of the Metallizing of Through-holes of PWBs

机译:使用“ INTROMET”设备进行PWB的通孔金属化质量检查

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摘要

Determination of the thickness of copper coatings in the through-holes is one of necessary steps in the manufacture of PWBs, since considerable part of rejects and later failures are related with inadequate quality of copper coatings inside the through-holes. Well-known method of microsections is suitable for only selective control due to its destructive nature (Fig. 1). Apart from that, it is expensive and laborious. There are also Caviderm CD-8 and CD-10 devices (Veeco Instrument Corp., UPA Technology Division, USA) based on the measurement of electrical resistance (Fig.2). Major disadvantages of these instruments: effects of contact phenomena on the results of the measurements and the impossibility of the measurements prior to etching and the need to get access to both sides of a hole. Thickness-measuring devices "INTROMET" have following advantages in comparison with other types of instruments:- Easy adjustment - it is necessary to introduce a sensor into the hole and to read the numerical values of the indicator expressed directly in micrometers;- The inspection of the coatings is possible at every stage of the process - from the initial stage of copper plating (directly at a plating tank) and also before and after the deposition of metal-resist coatings. This allows to reduce the copper-deposition time and energy consumption under the conditions of guarantied quality of copper deposits;- It is possible to make not only copper-plate thickness measurements, but also to detect failures such as cracks in the copper layer;- There is no need to destroy the board by cutting the specimen for the measurements, which is unavoidable, if electrical resistance is to be measured;- The access to one side of the boards is sufficient. The heart of the device is an eddy current sensor of a transformer type (US Pat. 5, 600, 240) both coils of which are placed inside a steel pipe and are located along with its axis (Fig.3). The principle of its functioning is illustrated in Figs. 4 and S. Technical characteristics of "INTROMET" tester are given in the Table. The instruments are shown in Fig. 6. Most advanced modification ITM-MP has been developed by INTROMETPLUS according to the order of Veeco Instrument Corp., UPA Technology Division and was first exposed at the international exhibition "Control 94" in Chicago in 1994 (Fig. 7). This device is capable to eliminate the interfering effects of changing ambient temperature on the results of the measurements. The effect of the hole diameter is also taken into account automatically, and the values of the board thickness and the conductivity of deposited copper can be introduced into memory of the device. The data obtained may be monitored to the external computer/printer through the interface PS-232. It is also possible to calibrate ITM-MP tester on the basis of the specimens of a customer. It is necessary for this purpose to use a set of PWBs with various thickness of copper layer (4 to 6 specimens representing the whole range of thickness). Some practical experience for the industrial use of the device is described.
机译:确定通孔中铜涂层的厚度是制造PWB的必要步骤之一,因为相当数量的次品和以后的故障与通孔内部铜涂层的质量不足有关。众所周知的显微切片方法由于具有破坏性,因此仅适用于选择性控制(图1)。除此之外,它昂贵且费力。也有基于电阻测量的Caviderm CD-8和CD-10设备(Veeco Instrument Corp.,UPA技术部,美国)(图2)。这些仪器的主要缺点是:接触现象对测量结果的影响以及蚀刻前无法进行测量,以及需要接近孔的两侧。与其他类型的仪器相比,厚度测量设备“ INTROMET”具有以下优点:-易于调节-必须将传感器引入孔中并读取以微米为单位直接显示的指示器的数值;-在该过程的每个阶段都可以使用该涂层-从镀铜的初始阶段(直接在电镀槽中)以及在沉积金属抗蚀剂涂层之前和之后都可以。在保证铜沉积质量的条件下,这可以减少铜沉积时间和能耗;-不仅可以进行铜板厚度测量,还可以检测诸如铜层裂纹之类的故障;-如果要测量电阻,则不必通过切割试样来破坏电路板,这是不可避免的;-进入电路板的一侧就足够了。该设备的心脏是一个变压器类型的涡流传感器(美国专利5、600、240),其两个线圈都放置在钢管内部并沿其轴线放置(图3)。其功能原理在图1和2中示出。在表4中给出了“ INTROMET”测试仪的技术特性。仪器如图6所示。最先进的修改版ITM-MP是INTROMETPLUS根据UPA技术部Veeco仪器公司的命令开发的,并于1994年在芝加哥国际展览会“ Control 94”上首次亮相(图7)。该设备能够消除环境温度变化对测量结果的干扰影响。还可以自动考虑孔径的影响,并且可以将板厚度和沉积铜的导电率的值引入器件的存储器中。可以通过PS-232接口将获得的数据监视到外部计算机/打印机。也可以根据客户的样品来校准ITM-MP测试仪。为此,必须使用一组具有各种厚度的铜层的PWB(4至6个样品代表整个厚度范围)。描述了该设备的工业用途的一些实践经验。

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