Development of Novel Micro Tensile Testing Instruments and Application in Characterizing Thin Films Mechanical Properties

摘要

The mechanical properties of thin film is very important information to design and apply MEMS devices. Tensile testing can extract the mechanical properties by simply mechanical behavior. There are even more on-going researches involving in the mechanical properties testing related fields. In the article, the authors research group in the Micro-Device Lab., National Tsing Hua University would like to introduce the design and fabrication of the tensile testing instrument. It's not easy to integrate the test specimen with the testing instrument due to etch selectivity. This research will provide a brand-new concept, using parylene passivation technique to protect the test specimen during etching processes. Parylene is a very inert chemically to the various etching test. The parylene passivation technique allows the user to change the test sample easily using the same fabrication process. Furthermore, the problems and difficulties resulting from the alignment and assembly of a thin film test specimen with the testing instrument can be prevented. The MEMS instrument consists of a thermal actuator, differential capacitance sensor, and supporting spring. Moreover, the load and displacement relationship can be calibrated by commercial instruments. In application, this study can be determining the mechanical properties.