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Application of lead-free soldering for lighting fixtures

机译:无铅焊接在灯具中的应用

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A flow-soldering process has been implemented for producing electronic circuit boards used in lighting fixtures by using lead-free solder to eliminate hazardous lead from the product. While examining the lead-free soldering conditions, which tend to make the melting point higher and wetting properties worse than conventional solder, the conditions required in components, flux and equipment were identified. Also, pitting and voids that saliently appear in lead-free solder were studied and it was confirmed that the resulting condition would deliver reliability equivalent to or better than conventional lead-based eutectic solder. In addition, by paying attention to the transition of solder composition as an alloy and tracing the composition change by the number of units produced, a composition control standard was examined and provisionary values of solder composition have been established.
机译:通过使用无铅焊料消除产品中的有害铅,已经实施了流焊工艺来生产用于照明设备的电子电路板。在检查无铅焊接条件时,确定了与传统焊料相比更高的熔点和较差的润湿性能,同时确定了组件,助焊剂和设备所需的条件。此外,研究了在无铅焊料中明显出现的点蚀和空隙,并证实了所产生的条件将提供与传统铅基共晶焊料相同或更好的可靠性。另外,通过注意作为合金的焊料组成的转变并通过生产的单元数追踪组成的变化,检查了组成控制标准,并确定了焊料组成的暂定值。

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