High temperature ICs for automotive applications

摘要

There is an increasing demand for ICs that are able to operate in high temperature environments such as close to car engines. To satisfy this demand, we have developed a bipolar IC that is able to operate at a junction temperature Tj ≤ 150 ℃ and atmospheric temperature Ta> 125 ℃. In this paper, the behavior of this IC at the temperature 150 ℃ is reported with reference to both the IC chip and the resin molded package. We reveal that the substrate leakage current of the PNP Tr and Au/Al junctions in wire-bonding are key factors affecting its reliability at high temperature. By analyzing these behaviors, it is have shown that this IC can operate with high reliability at Tj ≤ 150 ℃ and Ta> 125 ℃ for 3,000 continuous hours making it ideal for automotive applications.