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Dynamic viscoelasticity of silica particle/PET resin composites

机译:二氧化硅颗粒/ PET树脂复合材料的动态粘弹性

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In this study, both silane coupling agent treated silica particles (STSP) and untreated silica particles (UTSP) were dispersed in polyethylene terephthalate (PET) and the properties of these composites were evaluated. The mechanical properties of these silica particle/PET composites were investigated by dynamic viscoelasticity and SEM observations. The storage modulus at 40℃ (E'{sub}40) increased with concentration of silica particles. The E'{sub}40 of the UTSP/PET composites were larger than the corresponding values for the STSP/PET composites. These results were compared with theoretical values estimated from the Halpin-Tsai equations. These results showed that STSP/PET composites had few voids and aggregations of particles, which indicated that molecular interactions exist between STSP and PET. STSP dispersion in PET was random close packing. The glass transition temperature (T{sub}g) of PET filled with STSP increased by about 5℃ in comparison with neat PET independent of the concentration of STSP. On the other hand, for UTSP, which easily condenses in PET, T{sub}g was not increased by the addition of UTSP.
机译:在这项研究中,硅烷偶联剂处理的二氧化硅颗粒(STSP)和未处理的二氧化硅颗粒(UTSP)均分散在聚对苯二甲酸乙二醇酯(PET)中,并评估了这些复合材料的性能。通过动态粘弹性和SEM观察研究了这些二氧化硅颗粒/ PET复合材料的机械性能。 40℃下的储能模量(E'{sub} 40)随二氧化硅颗粒浓度的增加而增加。 UTSP / PET复合材料的E'{sub} 40大于STSP / PET复合材料的相应值。将这些结果与根据Halpin-Tsai方程估算的理论值进行比较。这些结果表明,STSP / PET复合材料几乎没有空隙和聚集,表明STSP和PET之间存在分子相互作用。 STSP在PET中的分散是随机密堆积。与纯PET相比,STSP填充的PET的玻璃化转变温度(T {sub} g)升高了约5℃,而与STSP的浓度无关。另一方面,对于容易在PET中冷凝的UTSP,通过添加UTSP不会增加T {sub} g。

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