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首页> 外文期刊>電子情報通信学会技術研究報告. マイクロ波·ミリ波フォトニクス >Recent Progress in Millimeter and Terahertz Wave Integrated Circuit Technologies for Communications and Sensing Applications
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Recent Progress in Millimeter and Terahertz Wave Integrated Circuit Technologies for Communications and Sensing Applications

机译:用于通信和传感应用的毫米波和太赫兹波集成电路技术的最新进展

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摘要

With the possibility of large absolute bandwidths, the millimeter-wave (mmW, 30 to 300 GHz) and Terahertz (THz) frequency range offer opportunities for high resolution sensing and high data-rate wireless communication. Many technologies have been proposed for operation in the mmW and THz frequency range, but for commercial application, they have to be low cost and easy to deploy. In this paper, possible technology candidates are introduced and their characteristics are discussed. The focus is on electronic systems using e.g. transistors compared to photonic systems using devices such as uni-traveling-carrier photo diodes. In the second part of the paper, we present a system for wireless data-transfer in the THz frequency range. It uses resonant tunneling diodes integrated with a Si-lens for radiation. With a demonstrated data-rate of 13 Gbps, it is a candidate for future THz wireless communication systems.
机译:由于具有绝对的大带宽,毫米波(mmW,30至300 GHz)和太赫兹(THz)频率范围为高分辨率传感和高数据速率无线通信提供了机会。已经提出了许多在毫米波和太赫兹频率范围内工作的技术,但对于商业应用,它们必须低成本且易于部署。本文介绍了可能的技术候选者,并讨论了它们的特性。重点是使用例如晶体管与使用单行进载流光电二极管的设备的光子系统相比。在本文的第二部分中,我们提出了一种在THz频率范围内进行无线数据传输的系统。它使用与Si透镜集成在一起的谐振隧穿二极管进行辐射。演示的13 Gbps数据速率使其成为未来THz无线通信系统的候选者。

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