3D sound localization real-time algorithm and its low power DSP implementation

摘要

This paper describes a real-time 3D sound localization algorithm to be implemented with the use of a low power embedded DSP. This algorithm first divides the audible frequency band into three, on the basis of the analysis of the sound diffraction phenomena through different media from a sound source to human ears, and then in each subband a specific procedure is devised for the 3D sound localization to operate on a 16bit fixed-point DSP. This processing of sound localization can greatly reduce the total computational labor without employing PEQs in low and high frequency subbands and can operate at a low frequency of 50MHz on DSP. Consequently, our implementation can effectively provide a listener with the 3D sound effects through a headphone at low cost and low power consumption.