Preparation of thermal-enhanced epoxy resin adhesive with organic PCM for applying wood flooring

摘要

Epoxy resins are well-known materials that show beneficial properties, such as high tensile strength and modulus, good adhesive properties, low cost, and ease of processing and environmental advantages. However, epoxy resin adhesive has no characteristic of thermal storage. Latent heat storage is one of the favorable kinds of thermal energy storage methods considered for energy saving and thermal efficiency in various fields, such as solar air conditioning systems and buildings. So we prepared thermal-enhanced epoxy resin adhesive by using PCM. This paper addresses the effects of n-hexadecane and sodium lauryl sulfate on the thermal properties and chemical properties of epoxy resin adhesive and HEAC, using differential scanning calorimetry, thermal gravimetric analysis, and Fourier transform-infrared spectroscopy. Also, we evaluated the applicability of composite epoxy resin adhesive to wood-based flooring using n-hexadecane, through measurement of bonding strength from universal testing machine analysis.