Kinetic study of a bismaleimide resin curing process by differential scanning calorimetry and rheological analysis

摘要

Curing reaction of a bismaleimide resin was investigated by dynamic differential scanning calorimetry at different heating rates. Activation energy was determined to be 91.861 kJ/mol on average by the Kissinger method and the Ozawa method. A piecewise fitting model was developed to describe the curing kinetic process. The piecewise model fitting results indicated a shift in the kinetic reaction mechanism from the Kamal model within the degree of cure range α < 0.6 to the n-order model when α exceeds 0.6. Rheological measurements including nonisothermal and isothermal testing were performed and the Arrhenius empirical model was applied to establish the chemorheolog model of the bismaleimide resin. The model obtained was proved to be in good agreement with experimental data.