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首页> 外文期刊>Journal of Physics, D. Applied Physics: A Europhysics Journal >Spark decomposition of SF6, SF6/N-2 (10 : 90 and 5 : 95) mixtures in the presence of solid additives (polyethylene, polypropylene or Teflon), gaseous additives (methane, ethylene, octofluoropropane, carbon monoxide or dioxide), water or oxygen
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Spark decomposition of SF6, SF6/N-2 (10 : 90 and 5 : 95) mixtures in the presence of solid additives (polyethylene, polypropylene or Teflon), gaseous additives (methane, ethylene, octofluoropropane, carbon monoxide or dioxide), water or oxygen

机译:在固体添加剂(聚乙烯,聚丙烯或特富龙),气态添加剂(甲烷,乙烯,八氟丙烷,一氧化碳或二氧化碳),水存在下,SF6,SF6 / N-2(10:90和5:95)混合物的火花分解或氧气

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The present paper is a continuation of the investigations on the sparking-induced decomposition of SF6 and SF6/N-2 (10: 90) Mixtures which have already been carried out in our laboratory, both experimentally and numerically. It concerns the decomposition of SF6/N-2 mixtures (100 kPa) containing 100%, 10% or 5 % of SF6, under high-energy sparks (3.6 J spark(-1)) generated in a 340 cm(3) experimental cell between a stainless steel point and a stainless steel plane. Our attention was focused on the following main by-products: (SF4 + SOF4 (SOF4 + SO2F2), S2F10, CF4, CO and CO,? which were studied by varying the concentration of the impurities added H2O, O-2 (0-0.2%), in the presence of atoms such as H and C released from vaporized solid insulators (polyethylene [C2H4](n), polypropylene [C3H6](n), Teflon [CF2](n)) or from gaseous additives (methane CH4 (0-4%), ethylene C2H4 (0-2%), octofluoropropane C3F8 (0-5%)), with the aim of simulating the occurrence of sparking in electrical devices, especially along spacers. As SF6/CO2 and SF6/N-2/CO2 mixtures are reported to be able to constitute promising SF6 substitutes for industrial applications, we also studied the chemical stability of SF6 and SF6/N-2 (5: 95) mixtures in the presence of 0-20% CO2. The presence of additives CH4, C2H4, C3F8 or solid insulator (polyethylene, polypropylene, Teflon) leads to lower production of (SF4 + SOF2) and S2F10 in dilute SF6 than in pure SF6 when the percentages of additives or the amounts of solid insulator vaporized are high. Concerning the additive CO2, we observe an increased production of (SOF4 + SO2F2) and a formation of large quantities of CO, more pronounced in SF6/N-2 (5 : 95) mixtures than in pure SF6. In contrast, the presence of CO leads to a lesser degree of decomposition of diluted than undiluted SF6. [References: 28]
机译:本文是关于火花引发的SF6和SF6 / N-2(10:90)混合物分解研究的延续,这些混合物已经在我们的实验室中进行了实验和数值研究。它涉及在340 cm(3)实验中产生的高能火花(3.6 J spark(-1))下包含100%,10%或5%SF6的SF6 / N-2混合物(100 kPa)的分解不锈钢点和不锈钢平面之间的单元。我们的注意力集中在以下主要副产物上:(SF4 + SOF4(SOF4 + SO2F2),S2F10,CF4,CO和CO ??,通过改变添加的H2O,O-2(0- 0.2%),在从气化的固体绝缘体(聚乙烯[C2H4](n),聚丙烯[C3H6](n),聚四氟乙烯[CF2](n))或气态添加剂(甲烷)释放出的H和C等原子存在下CH4(0-4%),乙烯C2H4(0-2%),八氟丙烷C3F8(0-5%)),目的是模拟在电气设备中,尤其是在垫片上产生火花的情况,例如SF6 / CO2和SF6 / N-2 / CO2混合物据报道能够构成工业应用中有希望的SF6替代品,我们还研究了在0-20%CO2存在下SF6和SF6 / N-2(5:95)混合物的化学稳定性添加剂CH4,C2H4,C3F8或固体绝缘体(聚乙烯,聚丙烯,特富龙)的存在导致稀释的SF6中的(SF4 + SOF2)和S2F10的产量低于纯SF6中的含量导电性或固体绝缘子的蒸发量很高。关于添加剂CO2,我们观察到(SOF4 + SO2F2)的产量增加和大量CO的形成,这在SF6 / N-2(5:95)混合物中比在纯SF6中更为明显。相反,与未稀释的SF6相比,一氧化碳的存在导致稀释后的分解度降低。 [参考:28]

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