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Crystallization of hydrogenated amorphous silicon deposited at high rate by dc magnetron sputtering

机译:直流磁控溅射高速率沉积的氢化非晶硅的结晶

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摘要

The crystallization of hydrogenated amorphous silicon (a-Si:H) films is studied by thermally annealing in the temperature range between 620 and 660 degrees C. The films are deposited by de magnetron sputtering on a quartz substrate at a rate around 1.5 nm/s. The crystallization kinetics are studied from the electrical conductivity which is measured in-situ under vacuum during thermal annealing. In the growth regime, the electrical conductivity variation can be fitted by a known crystallization model. This model permits determination of the characteristic time (t(c)) of the kinetics. The variation of t(c) versus the temperature of annealing shows a linear dependence in the Arrhenius representation. The t(c) and its activation energy are related to the growth and nucleation phenomena and t(c) is dependent on the film thickness. Its activation energy is 3.4 eV for a 0.64-mu m thick film and 2.4 eV for a 1.4-mu m thick film. (C) 1998 Elsevier Science B.V. All rights reserved. [References: 18]
机译:通过在620至660摄氏度之间的温度范围内进行热退火,研究了氢化非晶硅(a-Si:H)薄膜的结晶情况。该薄膜通过磁控溅射以1.5 nm / s的速率沉积在石英基板上。根据电导率研究结晶动力学,该电导率是在热退火过程中在真空下原位测量的。在生长方式中,电导率变化可以通过已知的结晶模型拟合。该模型允许确定动力学的特征时间(t(c))。 t(c)对退火温度的变化在阿伦尼乌斯(Arrhenius)表示中显示出线性关系。 t(c)及其活化能与生长和成核现象有关,t(c)与膜厚有关。对于0.64微米厚的膜,其活化能为3.4 eV,对于1.4微米厚的膜,其活化能为2.4 eV。 (C)1998 Elsevier Science B.V.保留所有权利。 [参考:18]

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