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首页> 外文期刊>Journal of Materials Chemistry, A. Materials for energy and sustainability >A facile approach to fabricate a UV/heat dual-responsive triple shape memory polymer
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A facile approach to fabricate a UV/heat dual-responsive triple shape memory polymer

机译:一种简便的方法来制造紫外线/热双响应三重形状记忆聚合物

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摘要

In the present work, a facile approach was employed to fabricate a UV/heat dual-responsive triple shape memory polymer (SMP) by simply mixing Zn(Mebip)(2)(NTf2)(2), a metallosupramolecular unit formed by coordinating 2,6-bis(N-methyl-benzimidazolyl)-pyridine (Mebip) ligands to zinc di[bis(trifluoromethylsulfonyl)-imide] (Zn(NTf2)(2)), into one part of epoxy resin. Dissimilar to previously reported UV sensitive SMPs with sophisticated molecular structure and relatively poor mechanical properties, the advantage of this approach is that the UV-sensitivity was simply achieved by employing Zn(Mebip)(2)(NTf2)(2), a UV-heat transfer compound, into the polymer matrix without significant sacrifice of thermal and mechanical properties. Also thanks to the light-heat transfer nature of Zn(Mebip)(2)(NTf2)(2) and segmented material structure, the resulting polymer displayed UV sensitivity to the composite part, while leaving the shape of the neat SMP part unchanged under the UV source (solely thermal sensitive). Thus the resulting composite displayed an excellent UV and heat selective localized triple shape memory effect.
机译:在目前的工作中,采用一种简便的方法通过简单地混合Zn(Mebip)(2)(NTf2)(2)(一种由2配位形成的金属超分子单元)来制造UV /热双响应三重形状记忆聚合物(SMP)。二[双(三氟甲基磺酰基)-酰亚胺]锌(Zn(NTf2)(2))的1,6-双(N-甲基-苯并咪唑基)-吡啶(Mebip)配体进入环氧树脂的一部分。与以前报道的具有复杂分子结构和相对较差的机械性能的UV敏感SMP不同,此方法的优势在于,只需使用Zn(Mebip)(2)(NTf2)(2),将化合物传热到聚合物基质中,而不会显着牺牲热和机械性能。另外,由于Zn(Mebip)(2)(NTf2)(2)的光热传递特性和分段的材料结构,所得聚合物对复合材料零件表现出UV敏感性,而在以下条件下,纯净SMP零件的形状保持不变紫外线源(仅对热敏感)。因此,所得复合材料显示出优异的UV和热选择性局部三重形状记忆效应。

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