Effects of processing history on thermal debinding

摘要

Thermal debinding behavior of silicon nitride parts processed via fused deposition of ceramics (FDC) and extrusion was studied. Heating rate, holding time, setter bed chemistry were some of the variables that were studied to understand their effect on green ceramic parts. Effect of processing history on the binder loss, porosity development and binder distribution profiles were examined on partially binder-burned-out samples. Results show that prior processing history has significant impact on binder distribution profiles and binder loss behavior.