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Removal analysis of WEDM's tapering process and its application to generation of precise conjugate surface

机译:WEDM锥度加工的去除分析及其在精确共轭表面生成中的应用

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摘要

Tapering process of WEDM, which can generate curved surfaces on workpiece, is a very unique ability of this machining process. This report is dedicated to the removal analysis of tapering WEDM and to the improvement of contouring accuracy in application to conjugate surfaces. An inclined discharge angle (IDA) analysis was proposed to study the removal mechanism with a novel point of view. Based upon the analysis, a theoretical removal model was proposed. Furthermore, it might be reasonable that the machining load and contouring error could be inferred from the removal burden. Therefore, an improvement strategy including control of discharged power and wire tension was proposed to adapt to the variation of machining load. Effects of the proposed method were verified through experiments. It is evident that the tapering accuracy was improved significantly, and it is feasible to the generation of precise conjugate surface.
机译:可以在工件上产生弯曲表面的WEDM的锥度加工是该加工过程的非常独特的功能。该报告专门用于锥度WEDM的去除分析,以及用于共轭表面的轮廓精度的提高。提出了倾斜排放角(IDA)分析,以一种新颖的观点研究去除机理。在此基础上,提出了一种理论上的去除模型。此外,从去除负担中推断出加工负荷和轮廓误差可能是合理的。因此,提出了一种控制功率和线张力的改进策略,以适应加工负荷的变化。通过实验验证了该方法的效果。显然,锥形精度显着提高,并且对于产生精确的共轭表面是可行的。

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