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Production and characterization of MgB{sub}2 coatings on various substrates by electrophoretic deposition

机译:电泳沉积在各种基材上制备和表征MgB {sub} 2涂层

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The electrophoretic deposition technique was applied for the production of MgB{sub}2 coatings on various substrates, such as Ni, Ag, stainless steel plates and Si wafers coated with Pt, by using a suspension of MgB{sub}2 powder in an organic solvent. The initial concentration of the suspension, the voltage applied, the kind of the organic solvent and the distance between the electrodes were investigated as these are the main parameters that affect the deposition rate of the processing and the quality of the coating produced. The appropriate subsequent sintering procedure was determined by means of thermal analysis techniques (TG, DTG, DTA). The produced coatings were characterized by several analytical techniques, such as XRD, SEM, RAMAN, DTA. The superconducting properties were measured by magnetic susceptibility measurements (SQUID). It resulted that by the optimized fast electrophoretic deposition technique and subsequent sintering procedure, uniform, dense and well-adhesive coatings on Ni, Ag and stainless steel substrates were obtained.
机译:通过使用MgB {sub} 2粉末在有机物中的悬浮液,将电泳沉积技术应用于在各种基材(例如镀有Pt的Ni,Ag,不锈钢板和Si晶片)上生产MgB {sub} 2涂层溶剂。研究了悬浮液的初始浓度,施加的电压,有机溶剂的种类以及电极之间的距离,因为这些是影响工艺沉积速率和所产生涂层质量的主要参数。借助热分析技术(TG,DTG,DTA)确定适当的后续烧结程序。通过几种分析技术,如XRD,SEM,RAMAN,DTA对生产的涂层进行了表征。通过磁化率测量(SQUID)测量超导性能。结果表明,通过优化的快速电泳沉积技术和随后的烧结程序,可以在Ni,Ag和不锈钢基材上获得均匀,致密和良好粘合的涂层。

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