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首页> 外文期刊>Journal of Friction and Wear >Stress-strain state of binder in vicinity of diamond grain under normal and tangential loads - Part 2: analysis
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Stress-strain state of binder in vicinity of diamond grain under normal and tangential loads - Part 2: analysis

机译:法向和切向载荷下金刚石晶粒附近粘合剂的应力应变状态第2部分:分析

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摘要

The present paper discusses the results of numerical calculation of displacements of a diamond grain, its rotation angle, stress tensor components of binder of cutting wheel as a function of normal and tangential components of load as well as of elastic characteristics of binder. The strains in radial and circumferential directions and the shear strains depending on the parameters identical to that for the stress tensor components were calculated.
机译:本文讨论了金刚石晶粒位移,其旋转角度,切割轮粘合剂的应力张量分量作为载荷的法向和切向分量以及粘合剂的弹性特征的数值计算结果。根据与应力张量分量相同的参数,计算了径向和周向的应变以及剪切​​应变。

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