Tribological Behavior of Thin Electroplated and Chemically Deposited Ni - P Coatings on Copper Substrates

摘要

The paper deals with the study of the tribological behavior of thin (1 and 5 μm thick) Ni-P coatings formed on plates made of electrotechnical copper by electroplating and chemical deposition. It has been found that after heat treatment, owing to diffusion processes, the coating components are capable of penetrating into the substrate material - to a depth of 15μm for electroplated coatings and of 35 μm for chemically deposited coatings) - and influencing the mechanical properties of a specimen such as the hardness and friction coefficient. A correlation between the wear mode of the coating and the method of its deposition has been found. The results show that thin (one μm thick and lesser) Ni-P chemically deposited coatings are promising for being used in friction units of precise mechanical devices.