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首页> 外文期刊>Journal of Electronic Materials >Effect of temperature and strain rate on mechanical properties of 63Sn/37Pb solder alloy
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Effect of temperature and strain rate on mechanical properties of 63Sn/37Pb solder alloy

机译:温度和应变速率对63Sn / 37Pb钎料合金力学性能的影响

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In this study, tensile tests of 63Sn/37Pb solder were carried out at various strain rates from 10{sup}-5 s{sup}-1 to 10{sup}-1 s{sup}-1 over a wide temperature range from -40℃ to 125℃ to study the effect of strain rate and testing temperatureon the mechanical properties in a systematic manner. Based on these experimental data, a set of empirical formulae was derived by a statistical method to describe the effect of temperature and strain rate in a quantitative manner and explain the variation in the mechanical properties published in other reports. It is concluded that the empirical formulae can be used to characterize the mechanical properties of 63Sn/37Pb over a wide range of temperatures and strain rates.
机译:在这项研究中,在从10 {sup} -5 s {sup} -1到10 {sup} -1 s {sup} -1的各种应变速率下,对63Sn / 37Pb焊料进行了拉伸测试-40℃至125℃以系统的方式研究应变率和测试温度对力学性能的影响。基于这些实验数据,通过统计方法得出了一组经验公式,以定量方式描述了温度和应变速率的影响,并解释了其他报告中公布的力学性能的变化。结论是,经验公式可用于表征63Sn / 37Pb在较宽的温度和应变速率范围内的力学性能。

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