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Electrodeposition of silver on a poly(o-aminophenol) modified platinum electrode

机译:银在聚(邻氨基苯酚)修饰的铂电极上的电沉积

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摘要

Electrodeposition of silver on a poly(o-aminophenol) (POAP) modified platinum electrode was studied by using cyclic voltammetry and chronoamperometry techniques. Results suggest that this process occurs at the polymer | electrode interface. The polymer film is rather indifferent to the electrodeposition of silver because of the low conductivity of the film at potentials where crystallization occurs. Experimental transients indicated that at very short times the process follows a three-dimensional and progressive nucleation pattern with diffusion controlled growth. At pH 5, the formation of silver-polymer amino-complexes may take place.
机译:使用循环伏安法和计时电流法研究了在聚(邻氨基苯酚)(POAP)修饰的铂电极上电沉积银的方法。结果表明该过程发生在聚合物上。电极接口。聚合物膜对银的电沉积相当无所谓,因为在发生结晶的电势下膜的电导率低。实验瞬态表明,在非常短的时间内,该过程遵循具有扩散控制生长的三维渐进形核模式。在pH 5时,可能会形成银聚合物氨基络合物。

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