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首页> 外文期刊>Journal of Adhesion Science and Technology: The International Journal of Theoredtical and Basic Aspects of Adhesion Science and Its Applications in All Areas of Technology >Effects of oxidation and plasma cleaning on the adhesion strength of molding compounds to dopper leadframes

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Effects of oxidation and plasma cleaning on the adhesion strength of molding compounds to dopper leadframes

机译：氧化和等离子体清洗对模塑料与多普勒引线框架粘合强度的影响

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来源
《Journal of Adhesion Science and Technology: The International Journal of Theoredtical and Basic Aspects of Adhesion Science and Its Applications in All Areas of Technology 》 |1999年第7期| 共16页
作者
YI SUNG; YUE CHEE YOON;
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原文格式 PDF
正文语种 eng
中图分类胶粘剂工业 ; 粘接、胶接 ;
关键词
Plasma cleaning; adhesion of molding compounds; oxidation of copper leadframes;

机译：等离子清洁;模塑料的粘合;铜引线框架的氧化;

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1. Effects of oxidation and plasma cleaning on the adhesion strength of molding compounds to dopper leadframes [J] . YI SUNG, YUE CHEE YOON Journal of Adhesion Science and Technology: The International Journal of Theoredtical and Basic Aspects of Adhesion Science and Its Applications in All Areas of Technology . 1999 ,第7期

机译：氧化和等离子体清洗对模塑料与多普勒引线框架粘合强度的影响
2. The effect of the oxidation of Cu-base leadframe on the interfaceadhesion between Cu metal and epoxy molding compound [J] . Soon-Jin Cho, Kyung-Wook Paik, Young-Gil Kim IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part B, Advanced Packaging . 1997 ,第2期

机译：铜基引线框的氧化对铜金属与环氧模塑化合物界面粘合的影响
3. The effect of the oxidation of Cu-base leadframe on the interfaceadhesion between Cu metal and epoxy molding compound [J] . Soon-Jin Cho, Kyung-Wook Paik, Young-Gil Kim IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part B, Advanced Packaging . 1997 ,第2期

机译：铜基引线框的氧化对铜金属与环氧模塑化合物界面粘合的影响
4. RBS measurement of the thickness of nanometer oxide layers: Adhesion strength between copper leadframe and molding compound correlated with the oxide layer thickness [C] . Schmidt, R., Hosler, Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st . 1997

机译：纳米氧化物层厚度的RBS测量：铜引线框架与模塑料之间的粘合强度与氧化物层厚度相关
5. Effects of elevated osmolality and carbon dioxide on the glycosylation of neural cell adhesion molecule and monoclonal antibody: Osmoprotectant compounds as mitigating agents. [D] . Schmelzer, Albert Ethan. 2001

机译：渗透压和二氧化碳浓度升高对神经细胞粘附分子和单克隆抗体的糖基化的影响：渗透保护剂化合物作为缓解剂。
6. The Effects of Silica-Based Fillers on the Properties of Epoxy Molding Compounds [O] . Mitja Linec, Branka Mušič 2019

机译：二氧化硅基填料对环氧模塑化合物性能的影响
7. Advanced technology of epoxy molding compounds production and strength characteristics of developed epoxy molding compounds [O] . Sh. I. Gemuev, A.I. Gemuev 2016

机译：环氧成型化合物的先进技术，发育环氧树脂成型化合物的生产和强度特性
8. Effects of Catalyst Ratio and Processing Conditions on UCC/SE-54/497XL Cellular Silicone Molding Compound [R] . Sanders, R. S. 1983

机译：催化剂配比和加工条件对UCC / sE-54 / 497XL蜂窝状有机硅模塑料的影响

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