Activated Conductive Layer for POWDER COATING on Wood

摘要

A metallic substrate is a conductor and the electrostatic application of powder coating can adhere quite easily.Wood,such as medium- and low-density fiberboard (MDF and LDF),are low conductivity substrates,which reduce dramatically application efficiency and inhibit a successful powder coating practice.For a powder coating processed at high temperature,metallic substrates can take the heat treatment,but wood would exude its moisture content and lose its structural value.In this article,we formulate an aqueous conductive emulsion of organic-inorganic hybrid that contains sol-gel coupling agents and a conductive nanomaterials dispersion.A single-coat application of this conductive emulsion on nonconductive substrates,followed by air-dry or a thermal drying at 65-80°C for 1 min,gives a thin f~ 1-5 jim),uniform,dense,and hard (2H-5H pencil hardness) conductive film that adheres extremely well (5B,ASTM D 3359) on a part's surface.The activated conductive emulsion film on non-conductive substrates offers excellent conditions for the applications of powder coating on MDF and LDF panels.The formulation chemistry of conductive emulsion will be described.