Matsushita Electric Works has created an entirely new type of conductive paste for use in semiconductor manufacturing processes that offers properties not possessed by existing conductive pastes.It is aiming for early commercialization by supplying samples to users.The new paste - a combination of tin-alloy metallic particles and an epoxy-based organic material - can enable both fused metal connections now provided by solders and point connections provided by silver paste.In addition,its metallic particles can fuse at temperatures as low as some 150 C,offering prospects for practical application in processes that require low temperatures,as well as mounting on polyethylene terephthalate substrates that cannot withstand high temperatures.As the paste uses no silver,it exhibits higher migration resistance than silver paste,resulting in higher electrical reliability.With more-stable conductivity based on fused metal connections,it can be used to mount high-current power devices in cars,and in the via-hole connections of buildup printed circuit boards.
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