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A model for dynamic recovery of bcc structure

机译:动态恢复密件抄送结构的模型

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GENERALLY the following two processes will take place simultaneously during hot deformation: one is work hardening caused by the increase of dislocation density on account of slip deformation; the other is softening caused by the process of recovery and recrystallization. The overall effect of the development of the two contrary processes is influenced by deformation temperature, rate and quantities. Among them temperature controls the rate of self-diffusion, which affects the proceeding of recoveryand recrystallization as well. During recovery the dislocation density is mainly determined by deformation rate ( ε ) and strain quantities (ε).
机译:通常,在热变形过程中将同时发生以下两个过程:一个是由于滑动变形而使位错密度增加而引起的加工硬化;第二个是由于热变形引起的位错密度增加。二是恢复和重结晶过程引起的软化。两种相反过程发展的总体效果受变形温度,速率和数量的影响。其中温度控制着自扩散的速度,这也影响了回收和重结晶的进行。在恢复过程中,位错密度主要由变形率(ε)和应变量(ε)决定。

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