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Depth-selective elemental imaging of microSD card by confocal micro XRF analysis

机译:通过共聚焦显微XRF分析对microSD卡进行深度选择元素成像

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摘要

A semiconductor device, a microSD card, was measured by using two XRF instruments. 2D elemental images were obtained using a micro-XRF system with a spatial resolution of 10μm. Elemental distributions of the near-surface region of the sample were clearly shown. Titanium was observed in the resin constituting the sample. Nickel and gold were observed on a terminal and localization of the sample. Elemental distribution of copper reflected the circuit structure of the measurement area that was in the neighborhood of the sample surface. Moreover, the elemental depth distributions of the sample were measured by using a confocal micro-XRF instrument. The confocal micro-XRF instrument was constructed in the laboratory with fine-focus polycapillary x-ray optics. The depth resolution of the developed spectrometer was 13.7 μm at an energy of Au Lβ (11.4 keV). The elemental images obtained at near-surface by confocal micro-XRF were the same as the results obtained from 2D micro-XRF. However, different Cu images were obtained at a depth of several tens of micrometers. This indicates that microSD cards consist of a few different Cu-circuit structure designs. The elemental depth distributions of each circuit structure of the semiconductor device were clearly shown by confocal micro-XRF.
机译:使用两个XRF仪器测量了一个半导体设备,即microSD卡。使用空间分辨率为10μm的微型XRF系统获得2D元素图像。清楚地显示了样品近表面区域的元素分布。在构成样品的树脂中观察到钛。在样品的末端和局部观察到镍和金。铜的元素分布反映了样品表面附近测量区域的电路结构。此外,通过使用共聚焦微型XRF仪器测量样品的元素深度分布。共聚焦微型XRF仪器是在实验室中用精细聚焦的多毛细管x射线光学器件制造的。在AuLβ(11.4 keV)的能量下,开发的光谱仪的深度分辨率为13.7μm。通过共焦微型XRF在近表面获得的元素图像与从2D微型XRF获得的结果相同。然而,在几十微米的深度处获得了不同的Cu图像。这表明microSD卡由几种不同的Cu电路结构设计组成。通过共聚焦微XRF清楚地示出了半导体器件的每个电路结构的元素深度分布。

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