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Electrodeposltlon of copper coating on AZ31 magnesium alloy

机译:AZ31镁合金上的铜涂层的电镀

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Magnesium and its alloys have limited wide applications due to their poor corrosion resistance. In this study, copper coating used as a plating nickel substrate was directly electrodeposited on AZ31 magnesium alloy from copper hydroxide and citrate bath with the addition of fluorine ion and additives using direct current. Copper coating was characterised using scanning electron microscopy (SEM) for observing surface and cross-section morphology of copper coating, by using scratched grid test for examining adhesion strength, by using immersion test for examining corrosion resistance. Observation by SEM showed that copper coating was the typical spherical nodular structure, thus providing uniform and dense appearance of copper coating. Adhesion strength test showed that copper coating was not peeled from AZ31 magnesium alloy when copper coating scratched to form grid was pulled using adhesive tape. Immersion test in 5% (m/v) NaCl solution revealed that copper coating is a protective layer on the AZ31 magnesium alloy.
机译:镁及其合金由于其耐腐蚀性差而在广泛的应用中受到限制。在这项研究中,用氢氧化铜和柠檬酸盐浴直接在AZ31镁合金上电沉积用作电镀镍基材的铜涂层,并使用直流电添加氟离子和添加剂。使用扫描电子显微镜(SEM)表征铜镀层,以观察铜镀层的表面和横截面形态,通过划痕网格测试以检查附着强度,通过浸入测试以检查耐腐蚀性。 SEM观察表明,铜涂层是典型的球形球状结构,从而提供均匀且致密的铜涂层外观。粘合强度测试表明,当用胶带拉扯划伤形成网格的铜涂层时,未从AZ31镁合金上剥离铜涂层。在5%(m / v)NaCl溶液中的浸入测试表明,铜涂层是AZ31镁合金上的保护层。

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