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Anti-corrosion solution for reduction and prevention of corrosion whiskers

机译:减少和防止腐蚀晶须的防腐溶液

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摘要

In 2007, the Tin Whisker User Group of the International Electronics Manufacturing Initiative (iNEMI) approved a new classification for matt and bright tin electrodeposits (see table 1) [1], revising the previous 2006 classification which had incorporated the use of bright tin electrolytes. This revision also implicated the tendency of bright electrodeposits to provide a highly-stressed crystal structure, together with a high carbon content which would influence whiskering [2,3] compared to the matte tin standard. These recommendations, however, were predominantly based on experiences gained from the first generation of bright tin processes, a 'far cry' from present 'state of the art' technology. The excellent performance of the latest bright tin processes has been well-proven, based on extensive whiskering studies (presented on several occasions) demonstrating no increased risk, compared to matte tin electrodeposits.[4-7].
机译:2007年,国际电子制造计划(iNEMI)的锡晶须用户组批准了亚光和光亮锡电沉积物的新分类(请参见表1)[1],修订了以前的2006年分类,该分类考虑了光亮锡电解质的使用。该修订版还暗示了亮电沉积物趋向于提供高应力晶体结构以及高碳含量的趋势,与磨砂锡标准相比,高碳含量会影响晶须[2,3]。但是,这些建议主要基于从第一代光亮锡工艺中获得的经验,这与当前的“最先进”技术相去甚远。根据广泛的晶须研究(多次提出),最新的光亮锡工艺的优异性能已得到充分证明,与无光锡电沉积相比,其风险没有增加。[4-7]。

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