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首页> 外文期刊>Talanta: The International Journal of Pure and Applied Analytical Chemistry >Chelating resin containing s-bonded dithizone for the separation of copper(II), nickel(II) and zinc(II)
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Chelating resin containing s-bonded dithizone for the separation of copper(II), nickel(II) and zinc(II)

机译:含s键合双硫zone的螯合树脂,用于分离铜(II),镍(II)和锌(II)

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摘要

Analytical and physicochemical properties of a crosslinked poly (vinyl pyridine) based resin containing dithizone were examined. The resin was further used for the preconcentration of copper, nickel and zinc at batch and column level. Various conditions such as pH, equilibration time, temperature were optimised for the maximum loading of copper, nickel and zinc. The loading capacities of the resin for copper, nickel and zinc were observed to be 0.51, 0.59 and 0.65 mmol g~(-1) of dry resin respectively. Elution of loaded copper, nickel and zinc from the resin was done by using 0.1 M HCl, 0.1 M H_2SO_4 and 0.1 M HNO_3 respectively. Separation of copper, nickel and zinc in binary and ternary mixtures was achieved without any cross contamination.
机译:检查了含有双硫zone的交联的聚(乙烯基吡啶)基树脂的分析和理化性质。该树脂还用于批量和塔级铜,镍和锌的预浓缩。优化了各种条件,例如pH,平衡时间,温度,以最大程度地负载铜,镍和锌。观察到该树脂对铜,镍和锌的负载能力分别为干燥树脂的0.51、0.59和0.65 mmol g〜(-1)。通过分别使用0.1 M HCl,0.1 M H_2SO_4和0.1 M HNO_3从树脂上洗脱负载的铜,镍和锌。实现了二元和三元混合物中铜,镍和锌的分离,而没有任何交叉污染。

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