'Electrtonic Component Encapsulation Compounds' are new from RTP Co

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'Electrtonic Component Encapsulation Compounds' are new from RTP Co

机译：RTP Co的新产品“电子元件封装化合物”

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《Plastics Business News 》 |2001年第2期| 共1页
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中图分类合成树脂与塑料工业 ;
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1. 'Electrtonic Component Encapsulation Compounds' are new from RTP Co [J] . plastics business news Group Plastics Business News . 2001 ,第2期

机译：RTP Co的新产品“电子元件封装化合物”
2. 'Electronic component encapsulation compounds' are new from RTP Co [J] . Plastics Focus Group Plastics Focus: An Interpretive News Report . 2001 ,第6期

机译：RTP Co的“电子元件封装化合物”是新的
3. 'Electronic Component Encapsulation Compounds' are new from RTP Co [J] . Plastics Week Group Plastics Week . 2001 ,第12期

机译：RTP Co的新产品“电子元件封装化合物”
4. Influence of cure dependency of molding compound properties on warpage and stress distribution during and after the encapsulation of electronics components [C] . Falat T., Jansen K.M.B., de Vreugd J., Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009 . 2009

机译：模塑料特性的固化依赖性对电子元件封装期间和之后的翘曲和应力分布的影响
5. Quantitative analysis of trace volatile compounds in complex matrices by automated SPME GC-MS/MS: Monitoring limonene oxidation products to benchmark oxidation in encapsulation systems. [D] . Emberger, Matthew Edward. 2015

机译：通过自动SPME GC-MS / MS对复杂基质中的痕量挥发性化合物进行定量分析：监测柠檬烯氧化产物，以测试封装系统中的氧化基准。
6. Differential Analysis of Serum Principal Components Treated with Compound Sophora Decoction and Related Compounds Based on High-Resolution Mass Spectrometry (HRMS) [O] . Wanjin Sun, Junjie Zhang, Conghui Zhou, 2020

机译：基于高分辨率质谱（HRMS）化合物槐花煎剂及相关化合物处理血清主成分的差异分析
7. STRENGTH OF ELECTRONIC COMPONENTS ENCAPSULATED WITH COMPOUND UNDER THERMAL IMPACTS [O] . Julius Boiko, Svitlana Petrashchuk, Igor Kovtun, 2019

机译：在热冲击下用化合物包封的电子元件强度

'Electrtonic Component Encapsulation Compounds' are new from RTP Co

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