Optoelectronic integrated circuits with additional opticalinplasers perform the data transfer functions, are considered. Themutual relationship and the `affinity' between optica^250Ll means for datatransfer and processing, on the one hand, and the traditionalelectronic component base, on the other, are demonstrated in the caseof implementation of three-dimensional interconnects with a hightransmission capacity. Attention is drawn to the problems encounteredwhen semiconductor injection lasers are used in communication lines.It is shown what role can be played by VCSE lasers in solving theseproblems. A detailed analysis is made of the topics relating topossible structural and technological solutions in the fabrication ofsingle lasers and of their arrays, and also of the problems hinderingintegrating of lasers into emitter arrays. Considerable attention isgiven to integrated circuits with optoelectronic smart pixels.Various technological methods for vertical integration of GaAs VCSElasers with the silicon substrate of a microcircuit (chip) arediscussed.
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