Microstructure of the HMX-Based PBX KS32 after Mechanical Loading

摘要

Non-destructive X-ray diffraction techniques were applied in order to monitor the influence of mechanical and shock-loading on the microstructure of the plastic-bonded high explosive KS32. The investigations uncovered damage to embedded coarse HMX crystals and to the binder system HTPB-IPDI. Damage to the crystals occurred already during the kneading process in terms of deformation twinning. On higher loading between 400 MPa (static) and 480 MPa (dynamic) also crystal fracture was observed. The change in the binder structure was found after both static and dynamic loading, but not in the cured, differently kneaded samples. Moreover, the change in binder structure after dynamic loading was verified by dynamic mechanical analysis, and interpreted as a partial damage of the binder rubber shell around the explosive particles. The results are compared to literature data from imaging techniques.