Conductive anodic filament have been increasing concerning about PCB reliability in the last few years. To meet miniaturizing needs and satisfy higher performances, a more and more mayor PCB density is forcing PCB design toward closer conductors, smaller pitches, single-ply dielectrics. Often electrical applications are requested to function in extreme temperature, humidity and voltages environments. Moreover RoHS legislation advent involves new materials experiencing, introducing different manufacturing conditions such as higher temperatures in assembling processes due to Lead free alloys. In this scenery materials insulation resistance becomes a crucial factor; to choose a proper laminate in PCB manufacturing process requires more care than in the past.
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