Novel organosoluble polyamide-imides with high glass transition temperature containing noncoplanar 2,2'-bis(trifluorodimethyl)-4,4'-biphenylene unit

摘要

The need for heat-resistant materials in aerospace and microelectronics industries has led to the development of heterocyclic polymers with targeted applications as dielectric films or passivation coatings in integrated circuits. For this purpose, it is desirable to use heterocyclic polymers, which are soluble for spin coating and casting processes. Polyimides are certainly one of the most successful classes of high-performance polymers and are widely used in these industries. However, most polyimides encounter processing difficulties due to their infusibility and poor solubility in organic solvents.