Polymer-Matrix Composites for Microelectronics

摘要

Polymer-matrix composite materials for microelectronics are reviewed in terms of the science and applicatioins. They include those with continuous and discontinuous fillers in the form of particles and fibres, as designed for high thermal conductivity, low thermal expansion, low dielectric constant, high/low electrical conductivity and electromagnetic interference shielding. Applicagtions include heat sinks, housings, printed wiring boards, substrates, lids, die attach, encapsulation, interconnections and thermal interface meterials.