Crosslinked liquid crystalline polyimide for screen printing applications

摘要

The current trend in electronics is towards increasing integration, miniaturisation and functionalisation, where conductors and insulators are packed ever closer together. If the insulating materials have low thermal conductivity, this can cause high levels of heat to be generated inside devices, leading to electric connection failures and reduced component lifetimes. One approach is to increase the thermal conductivity of the insulating materials by increasing filler content, but this leads to processing problems associated with increased viscosity and poor adhesion. Although the thermal conductivity of organic polymers is low, highly oriented polymers such as liquid crystalline polymers are a possible solution, providing thermal conductivity in the chain-aligned direction. For use in screen printing applications, solution processability and low transition temperatures are necessary.