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Moisture absorption effect on adhesive filled bonded joints

机译:对粘合剂填充的粘合接头的吸湿效果

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The effect of filler type and content on the performance and durability of adhesive bonded joints upon exposure to damp heat (water immersion ) has been investigated using concurrently step lap shear and thermo mechanical analysis (TMA) experiments. A TMA based approach is developed in order to predict the strength of the bonded constructions. Two types of fillers were used in order to achieve the objectives: glass beads (GB) and alumina ceramic powder (ACP). It is shown that ACP filled adhesives have higher strength retention than GB filled ones. It is also demonstrated that valuable information can be extracted from TMA measurements. Generally, the increase of the coefficient of thermal expansion (CTE) of the bonded joints is found to be in agreement with the decrease of the step lap joint strengths after exposure. The increase of the CTE of the bonded joints resulting from exposure to hot water seems to increase the stresses, which in turn affect the overall strength. Similarly, bulk adhesive results show that GB filled systems are more susceptible to water than ACP filled ones, which confirms the decrease in strength of GB filled bonded constructions. [References: 32]
机译:通过同时进行搭接剪切和热力学分析(TMA)实验,研究了填料类型和含量对粘合剂接头的性能和耐久性的影响,方法是暴露于湿热下(水浸)。为了预测粘合结构的强度,开发了一种基于TMA的方法。为了达到目的,使用了两种类型的填料:玻璃珠(GB)和氧化铝陶瓷粉末(ACP)。结果表明,ACP填充胶粘剂比GB填充胶具有更高的强度保持力。还证明了可以从TMA测量中提取有价值的信息。通常,发现粘合接头的热膨胀系数(CTE)的增加与暴露后阶梯搭接接头强度的降低是一致的。暴露在热水中导致的接合处CTE的增加似乎增加了应力,进而影响了整体强度。同样,散装粘合剂的结果表明,GB填充体系比ACP填充体系更易受水的影响,这证实了GB填充粘结结构的强度降低。 [参考:32]

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