Cu Diffusion Along Al Grain Boundaries

摘要

Grain boundary diffusion of copper (GBD) in aluminum was investigated by EPMA in the temperature range from 300 to 400°C. The triple product sδD_(gb) (s - segregation coefficient,δ- grain boundary width,D_(gb) - GBD coefficient) was calculated using Fisher-Gibbs solution methods -by measuring of GB copper concentration as a functional penetration depth and the contour angle (at the top of diffusion wedge).In the first case sδD_(gb)=5.1·10~(-11) m~3/s·exp[(-102kJ/mol)/(RT)] and in the second case sδD_(gb)=1.4·10~(-11)m~3/s·exp[(-94kJ/mol)/(RT)].