首页>外文期刊>IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A

IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A

中文名称：IEEE组件、包装制造技术。

ISSN：1070-9886
出版周期：Quarterly

发文量：425

期刊论文

热门论文

年度选择

更多>>

全选（0）

1.Thermal phenomena in compact electronic enclosures: a numerical study

机译：热现象在紧凑型电子围栏:一个数值研究
- 作者：Maudgal V.K.
- 期刊名称：《IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A》 | 1997年第3期
2.Modeling thermally induced viscoplastic deformation and low cycle fatigue of CBGA solder joints in a surface mount package

机译：建模热诱导皮筋粘塑性的拉力n和低循环疲劳的CBGA焊点表面安装包
- 作者：Bor Zen Hong;Burrell L.G.
- 期刊名称：《IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A》 | 1997年第3期
3.Moisture absorption and desorption predictions for plastic ball grid array packages

机译：水分吸收和解吸的预测塑料球阵列包
- 作者：Galloway J.E.;Miles B.M.
- 期刊名称：《IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A》 | 1997年第3期
4.Fatigue-strength prediction of microelectronics solder joints under thermal cyclic loading

机译：疲劳强度预测微电子热循环加载条件下ld关节
- 作者：Qiang Yu;Shiratori M.
- 期刊名称：《IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A》 | 1997年第3期
5.Perspectives to understand risks in the electronic industry

机译：在电子的角度来理解风险行业
- 作者：Dasgupta A.;Magrab E.B.
- 期刊名称：《IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A》 | 1997年第4期
- Electronics;
- research programmes;
- VolumePerspectiveelectronics industryindustries;
6.On the effect of nonlinear boundary conditions for heat conduction in diamond heat spreaders with temperature-dependent thermal conductivity

机译：在非线性边界条件的影响热传导与te钻石散热器mperature-dependent导热系数
- 作者：Ping Hui;Tan H.S.
- 期刊名称：《IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A》 | 1997年第4期
7.Finite element simulation of the temperature cycling tests

机译：有限元模拟的温度循环测试
- 作者：Basaran C.;Chandaroy R.
- 期刊名称：《IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A》 | 1997年第4期
8.CFD applied to electronic systems: a review

机译：CFD应用于电子系统:一个回顾
- 作者：Tucker P.G.
- 期刊名称：《IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A》 | 1997年第4期
9.Is the maximum acceleration an adequate criterion of the dynamic strength of a structural element in an electronic product?

机译：最大加速度是一个适当的标准吗动态强度的结构元素电子产品?
- 作者：Suhir E.
- 期刊名称：《IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A》 | 1997年第4期
10.Study of delaminated plastic packages by high temperature Moire and finite element method

机译：研究分层塑料包的温度高过后波纹和有限元方法
- 作者：Sheng Liu;Jiansen Zhu
- 期刊名称：《IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A》 | 1997年第4期
11.Fatigue crack propagation along polymer-metal interfaces in microelectronic packages

机译：疲劳裂纹扩展以及高分子金属强度在微电子rfaces包
- 作者：Guzek J.;Azimi H.
- 期刊名称：《IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A》 | 1997年第4期
12.The effect of varying the Cu/Au ratio on the thermal-cycle fatigue life of 95/5 PbSn bumps

机译：不同的铜/非盟的影响比小卡al-cycle疲劳寿命的95/5 PbSn疙瘩
- 作者：Haji-Sheikh M.J.;Ulz D.
- 期刊名称：《IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A》 | 1997年第4期
13.Intermetallic compound layer development during the solid state thermal aging of 63Sn-37Pb solder/Au-Pt-Pd thick film couples

机译：在th金属间化合物层的开发63年e固态热老化sn-37pb焊料/非盟-Pt-Pd厚膜夫妇
- 作者：Vianco P.T.;Stephens J.J.
- 期刊名称：《IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A》 | 1997年第4期
14.Electro-thermo-mechanical responses of conductive adhesive materials

机译：Electro-thermo-mechanical反应的导电粘合材料
- 作者：Hu K.X.;Chao-Pin Yeh
- 期刊名称：《IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A》 | 1997年第4期
15.Pressure loss modeling for surface mounted cuboid-shaped packages in channel flow

机译：压力损失模型表面安装长方体-形状的包在河道径流
- 作者：Teertstra P.;Yovanovich M.M.
- 期刊名称：《IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A》 | 1997年第4期
- channel flow;
- friction factor;
- airarraysFULL-SCALEPRESSURE LOSSpackagesSurface mounted;
16.Pressure drop and heat transfer in an isothermal channel with impinging flow

机译：压降和传热等温channel与撞击流
- 作者：Biber C.R.
- 期刊名称：《IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A》 | 1997年第4期
17.Design of circular heat spreaders on semi-infinite heat sinks in microelectronics device applications

机译：在半无限环形散热器的设计散热器在微电子设备的应用程序年代
- 作者：Ping Hui;Tan H.S.
- 期刊名称：《IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A》 | 1997年第4期
- Thermal resistance;
- heat;
- Spreadersheat sinks;
18.Compact air-cooled heat sinks for power packages

机译：小型风冷散热器对权力包
- 作者：Aranyosi A.;Bolle L.M.R.
- 期刊名称：《IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A》 | 1997年第4期
19.High power multichip modules employing the planar embedding technique and microchannel water heat sinks

机译：高功率多片模块采用平面如果嵌入技术和微通道水热量nks
- 作者：Hahn R.;Kamp A.
- 期刊名称：《IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A》 | 1997年第4期
- Access;
- Power dissipation;
- PlanarThermal resistanceheat removalembedded technologyheat sinks;
20.Issues in validating package compact thermal models for natural convection cooled electronic systems

机译：问题验证包紧凑的热模型自然对流冷却电子系统的年代
- 作者：Adams V.H.;Blackburn D.L.
- 期刊名称：《IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A》 | 1997年第4期
21.Compact models for accurate thermal characterization of electronic parts

机译：热characterizati紧凑模型准确的电子零件
- 作者：Vinke H.;Lasance C.J.M.
- 期刊名称：《IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A》 | 1997年第4期
22.Thermal characterization of chip packages-evolutionary development of compact models

机译：芯片packages-evolutio的热特性连紧凑型发展模式
- 作者：Bar-Cohen A.;Krueger W.B.
- 期刊名称：《IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A》 | 1997年第4期
- Thermal;
- Quality factor;
- preliminary designnumerical simulationchip package;
23.The world of thermal characterization according to DELPHI-Part II: Experimental and numerical methods

机译：世界上的热特性DELPHI-Part II:实验和数值方法年代
- 作者：Lasance C.J.M.;Rosten H.I.
- 期刊名称：《IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A》 | 1997年第4期
- Experimental Methods;
- Thermal;
- numerical modelsNumerical methods;
24.The world of thermal characterization according to DELPHI-Part I: Background to DELPHI

机译：世界上的热特性德尔福DELPHI-Part我:背景
- 作者：Rosten H.I.;Lasance C.J.M.
- 期刊名称：《IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A》 | 1997年第4期
25.Foreword SEMITHERM XIII

机译：前言SEMITHERM十三世
- 作者：Seri Lee;Manno V.P.
- 期刊名称：《IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A》 | 1997年第4期

客服邮箱：kefu@zhangqiaokeyan.com

客服微信
服务号