机译:Reliability of microsoldered thin copper-lead by low melting point Au/Sn microsoldering -a study on microjoining of leadframe for LSI package (No. 5)-
机译:Comparison of hot cracking susceptibilities of various Ni-base superalloys by U-type hot cracking test -a study on laser weldability of Ni-base superalloys (report 2)-
机译:The effect of oxide on the strength of an ultrasonically welded joint and welding process -study on the ultrasonic welding of dissimilar metals (2nd report)-
机译:The effect of oxide film on the strength of an ultrasonically welded joint, and welding process—Study on the ultrasonic welding of dissimilar metals(2nd report)