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Conference on Photonics Packaging, Integration, and Interconnects

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1.TAPER COUPLERS FOR COUPLING BETWEEN LASER AND SILICON WAVEGUIDE WITH LARGE ALLOWABLE TOLERANCE

机译：用于在激光和硅波导之间耦合的锥形耦合器，具有大容许耐受性
- 作者：Zhang Jing Li Bihan;Jayakrishnan Chandrappan;Zhang Qing Xin;Pamidighantam V Ramana;Patinharekandy Prabhathan;Lau Hon Shing;Kwong Dim Lee;Murukeshan Vadakke Matham
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- coupling efficiency;
- laser diode attachment;
- silicon waveguide;
- taper coupler;
- tolerance;
2.Cost effective optical coupling for polymer optical fiber communication

机译：用于聚合物光纤通信的成本有效的光学耦合
- 作者：Jayakrishnan Chandrappan;Zhang Jing;Ramkumar V Mohan;Philbert Oliver Gomez;Than Aye Aung;Xiao Yongfei;Pamidighantam V Ramana;John Lau Hon Shing;Dim Lee Kwong
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- polymer optical fiber;
- lensed fiber;
- optical coupling;
- simulation;
- detector;
- fabrication;
- characterization;
3.Optical hybrid package with an 8-channel 18GT/s CMOS transceiver for chip-to-chip optical interconnect

机译：具有8通道18GT / S CMOS收发器的光学混合封装，用于芯片到Chip-Chip光学互连
- 作者：E. Mohammed;J. Liao;A. Kern;D. Lu;H. Braunisch;T. Thomas;S. Hyvonen;S. Palermo;I. A. Young
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- Optical I/O;
- CMOS;
- CDR;
- VCSEL arrays;
- photodetector arrays;
- polymer waveguides;
- hybrid packaging;
- flip-chip;
4.Fully Embedded Board Level Optical Interconnects-From Point-to-Point Interconnection to Optical Bus Architecture

机译：完全嵌入板级别光学互连 - 从点对点互连到光学总线架构
- 作者：Xiaolong Wang;Ray T.Chen
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- optical interconnects;
- optical bus;
- 45° micro-mirrors;
- hard molding;
- polymer waveguide;
- optical printed circuit board;
5.3.125Gbps Multi Channel Electrical Transmission Line Design For CWDM

机译：3.125GPPS多通道电气传输线路设计用于CWDM
- 作者：Lim Teck Guan;Khoo Yee Mong;Li Jing;Chai Yi Yoon;Tan Chee Wei;Pamidighantam V Ramana;John Lau Hon Shing;Seiji Maruo
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- silicon optical bench;
- silicon dioxide;
- TFMS;
- planar lightwave circuit;
- TOSA;
6.Electro-Optic Waveguides with Conjugated Polymer Films Fabricated by the Carrier-Gas-Type Organic CVD for Chip-Scale Optical Interconnects

机译：具有由载体气体型有机CVD制造的共轭聚合物膜的电光波导，用于芯片级光学互连
- 作者：Kohtaro Matsumoto;Tetsuzo Yoshimura
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- optical waveguides;
- films;
- organic CVD;
- conjugated polymer;
- electro-optic (EO);
- selective aligned growth;
- selective growth;
- poly-azomethine;
7.20dB-enhanced coupling to slot photonic crystal waveguide based on multimode interference

机译：基于多模干扰的槽光子晶体波导增强20dB增强耦合
- 作者：Xiaonan Chen;Lanlan Gu;Wei Jiang;Ray T. Chen
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- slot photonic crystal waveguide;
- multimode interference;
- mode converter;
- active device;
8.Multi-channel Clock and Data Recovery Circuit for Chip-to-chip Optical Interconnects

机译：用于芯片到Chip光学互连的多通道时钟和数据恢复电路
- 作者：Trong-Hieu Ngo;Tae-Woo Lee;Hyo-Hoon Park
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- clock and data recovery circuit;
- chip-to-chip optical interconnect;
- gated oscillator;
- phase-locked loop;
9.Integration Challenges for Optical Interconnects

机译：光学互连的集成挑战
- 作者：Drew Alduino;Hai-Feng Liu;Abazar Mireshghi;Henning Braunisch;Christine Krause;Mario Paniccia
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
10.Design of fluidic self-assembly bonds for precise component positioning

机译：用于精确元件定位的流体自组装键设计
- 作者：Vivek Ramadoss;Nathan B. Crane
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- self assembly;
- capillary forces;
- accuracy;
- self assembly;
- preload force;
- force closure;
11.Low-cost, high-density optical parallel link modules and optical backplane for the last 1 meter regime applications

机译：低成本，高密度光学并行链路模块和光学背板，用于最后1米制度的应用程序
- 作者：Takashi Mikawa
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- optical backplane;
- optical parallel link module;
- monolithic VCSEL;
- optical coupling;
- self-alignment;
- low-cost;
- high-density;
- packaging;
- 40,100 GbEther systems;
- intra box;
12.Automatic Tester for High Power Diode Laser Bars

机译：高功率二极管激光器的自动测试仪
- 作者：Joern Miesner;Felix Frischkorn;Niels Uhlig
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- diode lasers;
- diode laser bars;
- LIV test;
- automatic tester;
13.Waveguide-coupled parallel optical transceiver technology for Tb/s-class chip-to-chip data transmission

机译：用于TB / S级芯片到芯片数据传输的波导耦合并行光收发器技术
- 作者：Fuad E. Doany;Clint L. Schow;Jeffrey A. Kash;Christian Baks;Russell Budd;Daniel M. Kuchta;Petar Pepeljugoski;Frank Libsch;Roger Dangel;Folkert Horst;Bert J. Offrein
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- optical interconnects;
- parallel optical links;
- optical transceivers;
14.Fast response organic light-emitting diode for visible optical communication

机译：用于可见光通信的快速响应有机发光二极管
- 作者：Takeshi Fukuda;Yoshio Taniguchi
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
15.Optical Design of 4-channel TOSA/ROSA for CWDM Applications

机译：用于CWDM应用的4通道TOSA / ROS的光学设计
- 作者：Geri E. Tangdiongga;Lim Teck Guan;Li Jing;Tan Chee Wei;Pamidighantam V Ramana;Chai Yi Yoon;Seiji Maruo;John Lau Hon-Shing
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- optical design;
- optical subassemblies;
- TOSA/ ROSA;
- silicon optical bench;
16.Optical Waveguide Films with Two-Layer Skirt-Type Core End Facets for Beam Leakage Reduction at 45° Mirrors

机译：光波导膜，具有双层裙型芯端面，用于在45°镜子下减小光束泄漏
- 作者：Tetsuzo Yoshimura;Kazuhiro Ogushi;Yohei Kitabayashi;Kaneyuki Naito;Yosuke Miyamoto;Masayoshi Miyazaki
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- optical waveguides;
- films;
- 45° mirrors;
- three-dimensional;
- optical wiring;
- optical circuits;
- optical interconnects;
- solar energy conversion systems;
- board;
- MCM;
- LSI;
- self-organized lightwave network (SOLNET);
- leakage;
- scattering;
17.Towards Flexible Routing Schemes for Polymer Optical Interconnections on Printed Circuit Boards

机译：朝着印刷电路板上的聚合物光学互连的灵活路由方案
- 作者：N. Hendrickx;G. Van Steenberge;E. Bosman;J. Van Erps;H. Thienpont;P. Van Daele
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- laser ablation;
- optical interconnections;
- polymer waveguides;
- coupling structures;
- printed circuit board;
- multilayer structures;
18.Driver-receiver combined optical transceiver modules for bidirectional optical interconnection

机译：用于双向光学互连的驱动器接收器组合光收发器模块
- 作者：Hyo-Hoon Park;Sae-Kyoung Kang;Do-Won Kim;Nguyen T. H. Nga;Sung-Hwan Hwang;Tae-Woo Lee
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- optical transceiver;
- bidirectional optical link;
- driver;
- receiver;
- transceiver module;
- optical PCB;
19.Comparison of Bandwidth Limits for On-card Electrical and Optical Interconnects for 100 Gb/s and Beyond

机译：用于100 GB / s及更高的卡片电气和光学互连带宽限制的比较
- 作者：Petar Pepeljugoski;Mark Ritter;Jeffrey A. Kash;Fuad Doany;Clint Schow;Young Kwark;Lei Shan;Dong Kam;Xiaoxiong Gu;Christian Baks
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- optical interconnects;
- electrical interconnects;
20.Er_xY_(2-x)SiO_5 nanocrystal and thin film for high gain per length material

机译：ER_XY_（2-X）SIO_5纳米晶体和薄膜，每个长度的高增益
- 作者：Kiseok Suh;Heeyoung Go;Shin-Young Lee;Jee Soo Chang;Moon-Seung Yang;Jung H. Shin
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- erbium;
- silicate;
- upconversion;
- Si photonics;
21.A Duplex 10 Gb/s Serial Active Optical Cable for Short-Reach Applications.

机译：用于短距离应用的双工10 GB / S串行有源光缆。
- 作者：Lewis B. Aronson;James Douma;Greta Light;Don Ice;The-Linh Nguyen
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
22.Short-reach flexible optical interconnection using embedded edge-emitting lasers and edge-viewing detectors

机译：使用嵌入式边缘发光激光器和边缘观察探测器短到达灵活的光学互连
- 作者：Shu-Hao Fan;Daniel Guidotti;Claudio Estevez;Gee-Kung Chang;Ying-Jung Chang;Daoqiang Daniel Lu
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- optical interconnects;
- edge-viewing detector;
- polymer waveguide;
23.Advances in photonics thermal management and packaging materials

机译：光子热管理和包装材料的进步
- 作者：Carl Zweben
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
24.Design and Analysis of 3D Stacked Optoelectronics on Optical Printed Circuit Boards

机译：光印刷电路板3D堆叠光电子的设计与分析
- 作者：John H. Lau;Lim Ying Ying;Lim Teck Guan;Tang Gong Yue;Khong Chee Houe;Xiaowu Zhang;Pamidighantam V Ramana;Zhang Jing;Tan Chee Wei;Jayakrishnan Chandrappan;Joey Chai;Li Jing;Geri Tangdiongga;Kwong Dim Lee
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- 3D bare chips stacking;
- VCSEL;
- PIN;
- serializer;
- deserializer optical PCB;
- Cu post;
- and leadfree solder joint;
25.Merging parallel optics packaging and surface mount technologies

机译：合并并联光学包装和表面贴装技术
- 作者：Christophe Kopp;Marion Volpert;Julien Routin;Stephane Bernabe;Cyrille Rossat;Myriam Tournaire;Regis Hamelin
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- datacom;
- packaging;
- optical interconnects;
- parallel optics;
- transceiver;
26.Stable and high-efficiency optical transmitter using VCSEL-direct- bonded connection block

机译：使用VCSEL直接连接块的稳定和高效的光发射器
- 作者：Do-Won Kim;Tae-Woo Lee;Mu Hee Cho;Hyo-Hoon Park
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
27.A high-speed 850-nm optical receiver by integrating Si photodiode and CMOS IC

机译：通过集成Si光电二极管和CMOS IC，高速850-NM光学接收器
- 作者：Y. M. Hsin;W. K. Huang;Y. C. Liu;B. E. Yan;W. Z. Chen
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- Si;
- 850-nm;
- optical receiver;
- CMOS;
- photodiode;
28.Light Coupling in Micro-Optic Systems: Past, Present, and Trends

机译：微视科系统中的光耦合：过去，存在和趋势
- 作者：Y. G. Soskind
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- micro-optics;
- coupling;
- optical design;
- MEMS;
- photonic crystals;
29.Assembly of Optical MUX/DEMUX on Silicon Optical Bench with High Placement Accuracies

机译：具有高放置精度的硅光凳上的光学MUX / DEMUX组装
- 作者：Tan Chee Wei;Lim Teck Guan;Li Jing;Tangdiongga Geri Endrio;Chai Yi Yoon;Seiji Maruo;Pamidighantam V Ramana;Yoon Seung Wook;John H. Lau
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- accuracy;
- adhesive;
- coupling efficiency;
- passive alignment;
- silicon optical bench;
30.Integration of Optical I/O with Organic Chip Packages

机译：光学I / O与有机芯片封装的集成
- 作者：Christoph Berger;Laurent Dellmann;Peter Dili;Folkert Horst;Bert J. Offrein;Martin Schmatz;Stefano Oggioni;Mauro Spreafico;Giulio Macario
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- optical interconnects;
- packaging;
- electro-optical packaging;
- processor package;
31.Optical design of a miniature semi-integrated tunable laser on a Silicon Optical Bench

机译：硅光学台上的微型半集成可调激光的光学设计
- 作者：Pamidighantam V Ramana;Li Jing;Jayakrishnan Chandrappan;Lim Teck Guan;Zhang Jing;John Lau Hon Shing;Dim Lee Kwong
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- tunable laser;
- MEMS;
- silicon optical bench;
- miniature optical packaging;
- DWDM transponders;
32.Development of a Low Cost 2.5-Gbps SFP Optical Transceiver using 0.18μm CMOS ICs

机译：使用0.18μmCMOSICS开发低成本2.5-Gbps SFP光学收发器
- 作者：Chai Yi Yoon;Zhang Jing;Pamidighantma V Ramana;Yap Guan Jie;John Lau Hon-Shing
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- 2.5-Gbps SFP;
- optical transceiver;
- 0.18μm CMOS technology;
- FTTH;
- GPON;
33.Full Automatic Packaging of a Hybrid Transceiver Module

机译：Hybrid收发器模块的全自动包装
- 作者：Felix Frischkorn;Joern Miesner;Sebastian Glass
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
34.Polymer Optical Motherboard Technology

机译：聚合物光学主板技术
- 作者：N. Keil;H. Yao;C. Zawadzki;N. Grate;M. Schell
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- hybrid integration;
- polymer waveguide;
- polymer motherboard;
- passive alignment;
- optical coupling;
35.Surface Mount Optical Interconnects

机译：表面安装光学互连
- 作者：Edward Palen
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- optical interconnect;
- automated assembly;
- SMT;
- fiber connector;
- micro-optics;
- low cost;
- SMOC;
- Zero-Level-Laser-Chip-Packaging;
36.Electro-optical circuit boards using thin-glass sheets with integrated optical waveguides

机译：使用具有集成光波导的薄玻璃板的电光电路板
- 作者：Axel Beier;Henning Schroeder;Norbert Arndt-Staufenbiel;Frank Ebling;Martin Franke;Elmar Griese;Steffan Intemann;Jan Kostelnik;Thomas Kuehler;Roland Moedinge;Ingo Roda;Ingolf Schlosser
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- electro-optical PCB;
- waveguides;
- ion exchange;
- two layers;
- optical coupling;
- pluggable modules;
37.SU8-based Static Diffractive Optical Elements: Wafer-level Integration with VCSEL arrays

机译：基于SU8的静态衍射光学元件：与VCSEL阵列的晶圆级集成
- 作者：A. Gracias;N. Tokranova;J. Castracane
- 会议名称：《Conference on Photonics Packaging, Integration, and Interconnects》 | 2008年
- optical interconnect;
- diffractive optical element;
- SU8;
- wafer-level integration;
- VCSEL;