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International Symposium on Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging and High Density Interconnection PCB

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1.3D Passive Devices and Through-Substrate Connections for Medical and Automotive Applications

机译：3D用于医疗和汽车应用的无源设备和通过基板连接
- 作者：C. Bunel;E. Lefeuvre;S. Jacqueline;M. Jatlaoui
- 会议名称：《International Symposium on Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging and High Density Interconnection PCB》 | 2019年
2.Line Width and Capping Layer Effects on Electromigration Failure of Plasma Etched Copper Lines

机译：线宽和覆盖层对等离子体蚀刻铜线电迁移失效的影响
- 作者：Mingqian Li;Jia Quan Su;Yue Kuo
- 会议名称：《International Symposium on Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging and High Density Interconnection PCB》 | 2019年
3.Molybdenum Capping Layer Effect on Electromigration Failure of Plasma Etched Copper Lines

机译：钼覆盖层对等离子蚀刻铜线电迁移失效的影响
- 作者：Jia Quan Su;Mingqian Li;Yue Kuo;Satoshi Hamaguchi
- 会议名称：《International Symposium on Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging and High Density Interconnection PCB》 | 2019年
4.Application of Three Dimensional Chip Stacking Technology for Fully Depleted Silicon-on-Insulator Quantum Beam Imager

机译：三维芯片堆叠技术在完全耗尽硅上叠加量子束成像仪中的应用
- 作者：I. Kurachi;T. Tsuboyama;Y. Arai;M. Motoyoshi
- 会议名称：《International Symposium on Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging and High Density Interconnection PCB》 | 2019年
5.Model Identification for Adsorption Dynamics and Suppression effect of Polyethylene Glycol using Inverse Analysis Approach

机译：逆分析方法对聚乙二醇的吸附动力学和抑制作用的模型鉴定
- 作者：T. Ishii;K. Amaya;Y. Onishi
- 会议名称：《International Symposium on Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging and High Density Interconnection PCB》 | 2019年