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IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network

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1.High Temperature 256Kbit (32Kbit × 8) HTEEPROM Reliability Testing

机译：高温256kbit（32Kbit×8）HTEEPROM可靠性测试
- 作者：Joe G. Guimont;Bruce W. Ohme
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- High-temperature electronics;
- EEPROM;
- Reliability;
- SOI CMOS;
- Non-volatile Memory;
2.KEMET SMD Film Capacitors for High Temperature Applications

机译：KEMET SMD薄膜电容器用于高温应用
- 作者：Luca Caliari;Paola Bettacchi;Evangelista Boni;Davide Montanari;Arrigo Gamberini;Luigi Barbieri;Francesco Bergamaschi
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- Drilling;
- Temperature;
- Capacitor;
- Current;
- Voltage;
- Automotive;
3.Enhanced High Temperature Performance of PD-SOI MOSFETs in Analog Circuits Using Reverse Body Biasing

机译：使用反向体偏置增强了模拟电路中的PD-SOI MOSFET的高温性能
- 作者：Alexander Schmidt;Holger Kappert;Rainer Kokozinski
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- SOI-CMOS;
- PD-SOI;
- FD-SOI;
- High Temperature;
- G_m=I_d;
- Intrinsic Gain;
- Leakage Currents;
4.The European SEEL (Solutions for energy efficient lighting) project: High temperature electronics for LED-lighting architectures

机译：欧洲SEEL（节能照明的解决方案）项目：LED照明架构的高温电子产品
- 作者：S. Habenicht;H. J. Funke;D. Gruber;D. Oelgeschlager;O. Schumacher;R. Gehn;S. Walczyk;A. Mavinkurve;Th. Reiners;R. Fiederling
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
5.Precision Analog Signal Conditioning Semiconductors for Operation in Very High Temperature Environments

机译：精密模拟信号调节半导体，用于在非常高的温度环境中的操作
- 作者：Michael Arkin;Jeff Watson;Michael Siu;Michael Cusack
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- High Temperature Electronics;
- Signal Conditioning;
- Semiconductors;
- Operational Amplifier;
- Voltage Reference;
6.DIP Test Socket Characterization for 300°C

机译：DIP测试插座表征300°C
- 作者：David Shaddock;Liang Yin;Zhenzhen Shen;Zhangming Zhou;R. Wayne Johnson
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- High Temperature Electronics;
- Electrical Test;
7.Novel encapsulation materials for High Pressure-High Temperature (HPHT) applications

机译：高压高温（HPHT）应用的新型封装材料
- 作者：Eric Jian Rong Phua;Ming Liu;Riko I. Made;Liying Zhang;Chee Cheong Wong;Zhong Chen;Min Woo Rhee;Xiao Hu;Chee Lip Gan
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- Encapsulation;
- HPHT;
- Thermoset polymer resin;
8.Reliability of Au-Ti for High Temperature Termination on Ferrite LTCC Inductors

机译：铁氧体LTCC电感器高温终止AU-TI的可靠性
- 作者：James Galipeau
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- Termination Reliability;
- Ferrite LTCC Magnetics;
- Au-Ti;
9.POL and LDO for Harsh Environment Applications

机译：POL和LDO用于恶劣环境应用
- 作者：Ramesh Khanna;Srinivasan Venkataraman
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- DC-DC Power Conversion;
- MOSFETs;
- High Temperature;
- Controller;
- Current mode control;
- LDO;
10.Packaging technologies for high temperature control electronics

机译：高温控制电子产品的包装技术
- 作者：Conor Slater;Radisav Cojbasic;Thomas Maeder;Yusuf Leblebici;Peter Ryser
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- High temperature packaging;
- CPUs and MCUs;
- Reliability;
11.Evaluation of Pressure Free Nanoparticle Sintered Silver Die Attach on Silver and Gold Surfaces

机译：无压纳米颗粒烧结银模具对银和金表面的评价
- 作者：G. Lewis;G. Dumas;S. H. Mannan
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
12.Communication system for down-hole measurement tools based on real-time SNR characterization in coaxial cable used as communication channel

机译：基于用于通信通道的同轴电缆中的实时SNR表征的基于实时SNR测量工具的通信系统
- 作者：Rito Mijarez;David Pascacio;Ricardo Guevara;Olimpia Pacheco;Carlos Tello;Joaquin Rodriguez
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
13.Advanced Applications of High Temperature Magnetics

机译：高温磁性的先进应用
- 作者：John R. Fraley;Edgar Cilio;Bryon Western
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- High temperature;
- Magnetics;
- Sensors;
- Novel device;
- Saturable reactor;
- Extreme environment;
- Current sensor;
14.A High Temperature, Fast Switching SiC Multi-chip Power Module (MCPM) for High Frequency (> 500 kHz) Power Conversion Applications

机译：高温，快速切换SiC多芯片电源模块（MCPM），用于高频（> 500 kHz）电源转换应用
- 作者：Z. Cole;B. S. Passmore;B. Whitaker;A. Barkley;T. McNutt;A. B. Lostetter
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- Silicon Carbide (SiC);
- High Temperature Power Electronics Packaging;
- High Frequency;
- Multi-Chip Power Modules;
15.230C Hermetically Sealed SMD Tantalum Capacitors

机译：230C气密密封SMD钽电容器
- 作者：T. Zednicek;M. Biler;J. Petrzilek;I. Pinwill;R. Faltus
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
16.High Temperature Characterization and Reliability Data of Key Semiconductor Technologies for Power and Control Devices

机译：功率和控制设备关键半导体技术的高温表征和可靠性数据
- 作者：Brian Wilkinson;Kent Walters;Paul Ellerman
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- SiC Diode;
- Effect of Temp on Reliability Calculations;
- Tungsten Plug;
- 300°C;
- I_R V_R Graph;
- I_F V_F Graph;
17.Robust True LDO Linear Voltage Regulator and Digitally Trimmable Buffered Precision Voltage Reference for High-Temperature, Low-Voltage Applications

机译：坚固的真正的LDO线性电压稳压器和高温，低压应用的数字尺寸可调缓冲精密电压参考
- 作者：Yoann Duse;Fabien Laplace;Nicolas Joubert;Xavier Montmayeur;Noureddine Zitouni;Sebastien Vieusses;Gregory Thepaut;Arnaud Anota;Gonzalo Picun
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- High-temperature electronics;
- Low-dropout linear regulator;
- Voltage reference;
- SOI;
18.LT-TLPS Die Attach for High Temperature Electronic Packaging

机译：LT-TLPS模具安装高温电子包装
- 作者：Hannes Greve;F. Patrick McCluskey
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
19.Lead-free Solder Attach for 200°C Applications

机译：无铅焊料安装200°C应用
- 作者：Zhenzhen Shen;Kun Fang;Mike Hamilton;R. Wayne Johnson;Erica Snipes;Michael Bozack
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- High temperature operation;
- Soldering;
- Die attach;
20.A 4H-SiC Bipolar Technology for High-temperature Integrated Circuits

机译：用于高温集成电路的4H-SIC双极技术
- 作者：L. Lanni;B. G. Malm;C. M. Zetterling;M. Oerstling
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
21.Multi-bit memory cell using long-range non-anchored actuation for high temperature applications

机译：使用远程非锚定驱动的多位存储器单元用于高温应用
- 作者：Mehrdad Elyasi;Chengkuo Lee;Cheng-Yu Hsieh;Dim-Lee Kwong
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
22.Advanced Ceramic Capacitor Solutions for High Temperature Applications

机译：高温应用的先进陶瓷电容器解决方案
- 作者：Abhijit Gurav;Xilin Xu;Jim Magee;Paul Staubli;John Bultitude;Travis Ashburn
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- High temperature capacitor;
- Ceramic Capacitor;
- BME MLCC;
- C0G;
23.Silicon Capacitors with extremely high stability and reliability ideal for high temperature applications

机译：硅电容器具有极高的稳定性和可靠性，适用于高温应用
- 作者：Catherine Bunel;Laurent Lengignon
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- High-density Silicon capacitors;
- Decoupling capacitors;
- Passive integration;
- High reliability;
- High stability;
- PICS;
24.1200 V SiC Schottky Rectifiers optimized for ≥ 250°C operation with low junction capacitance

机译：1200 V SiC舒张整流器优化≥250°C，具有低结电容
- 作者：Ranbir Singh;Siddarth Sundaresan
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
25.A High Temperature, Frequency Output Silicon Temperature Sensor

机译：高温，频率输出硅温传感器
- 作者：Shane Rose;Mark Hahn
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- Temperature Sensor;
- CMOS;
- High Temperature Electronics;
26.A 250°C ASIC Technology

机译：250°C ASIC技术
- 作者：Lynn Reed
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
27.Evaluation of Refractory Metals for Package Level Interconnection in a Harsh Environment

机译：苛刻环境中包装级互连难治性金属的评估
- 作者：Riko I. Made;Eric Jian Rong Phua;Key Wen Tan;Wei Chuan Ong;Clare Guanqi Huang;Hock Guan Ong;Vivek Chidambaram Nachiappan;Chee Cheong Wong;Chen Zhong;Chee Lip Gan
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- Interconnection;
- High temperature;
- High pressure;
- Electrical;
- Resistance;
- Adhesion;
28.High Temperature Reliability Investigations up to 350°C of Gate Oxide Capacitors realized in a Silicon-on-Insulator CMOS-Technology

机译：高温可靠性调查高达350°C在绝缘体上实现的栅极氧化物电容器在绝缘体上实现了CMOS技术
- 作者：K. Grella;S. Dreiner;H. Vogt;U. Paschen
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- Silicon-on-Insulator (SOI);
- Oxide Reliability;
- Time-Dependent Dielectric Breakdown (TDDB);
29.Precise Chip Joint Method with Sub-micron Au Particle for High-density SiC Power Module Operating at High Temperature

机译：高密度SiC电源模块的亚微米AU粒子的精确芯片联合方法
- 作者：Fumiki Kato;Fengqun Lang;Simanjorang Rejeki;Hiroshi Nakagawa;Hiroshi Yamaguchi;Hiroshi Sato
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- Precise chip joint;
- Sub-micron Au particle;
- High-density SiC power module;
- High-temperature Operation;
30.Long Term Demonstrated Performance Characteristics for Improved High Temperature Ceramic Capacitors Intended for Use in Extreme, Harsh Environments

机译：长期显示出用于在极端，恶劣环境中使用的改进的高温陶瓷电容器的性能特性
- 作者：Mustafa A. Syammach;Mustapha Habibi;Fauzi A. Syammach
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- High-temperature;
- Capacitors;
- Performance characteristics;
- Packaging;
- Long Term;
- And Reliability;
31.High temperature, Smart Power Module for aircraft actuators

机译：用于飞机执行器的高温，智能电源模块
- 作者：Khalil EL FALAHI;Stanislas HASCOET;Cyril BUTTAY;Pascal BEVILACQUA;Luong-Viet PHUNG;Dominique TOURNIER;Bruno ALLARD;Dominique PLANSON
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- Power electronics;
- SiC;
- SOI;
- Power module;
32.Reliability of SiC Digital Telemetry Circuits on AlN Substrate

机译：ALN衬底上SIC数字遥测电路的可靠性
- 作者：Reza Ghandi;Cheng-Po Chen;Liang Yin;Rich Saia;Tammy Johnson;Peter Sandvik;Kun Fang;R. Wayne Johnson
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- Silicon Carbide;
- Digital Telemetry;
- Geothermal;
- MOSFETs;
33.The Thermal Integrity of Integrated GaN Power Modules

机译：集成GaN电源模块的热完整性
- 作者：J. Roberts;T. MacElwee;L. Yushyna
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- Gallium nitride (GaN);
- High power;
- And high temperature;
34.Effectiveness of Barrier Layer Metallisations in Long Term High Temperature Endurance Tests on Wire Bond Interconnections

机译：在线键合互连长期高温耐久性测试中阻挡层金属化的有效性
- 作者：S. T. Riches;C. Johnston;A. Lui
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- Silicon-on-Insulator devices;
- High temperature electronics packaging;
- Intermetallics;
- Wire bonding;
35.Demonstration of a 300°C Capable Directional Drilling Steering Tool (DM300)

机译：演示300°C的定向钻孔转向工具（DM300）
- 作者：D. MacGugan
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- Silicon-on-Insulator;
- Directional drilling;
- Flux-gate magnetometers;
- MEMS accelerometers;
36.Reliability of wire-bonded electronic devices in combined high temperature and vibrational environments

机译：高温振动环境中引线电子设备的可靠性
- 作者：M. Mirgkizoudi;C. Liu;P. Conway;S. Riches
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- Wire bonding;
- High temperature applications;
- Reliability;
- Vibration testing;
37.Experimental Investigation of Electro-thermal Stress Impact on SiC-BJTs Electrical Characteristics

机译：电热应力影响对SiC-BJTS电特性的实验研究
- 作者：Thibaut Chailloux;Cyril Calvez;Pascal Bevilacqua;Dominique Planson;Dominique Tournier
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- BJT;
- Silicon carbide;
- Electrical stress;
- Thermal stress;
- Stability;
38.High-Temperature Characterization and Comparison of 1.2 kV SiC Power Semiconductor Devices

机译：1.2 kV SiC电源半导体器件的高温表征及比较
- 作者：Christina DiMarino;Zheng Chen;Dushan Boroyevich;Rolando Burgos;Paolo Mattavelli
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
39.Performance and Reliability Characterization of 1200 V Silicon Carbide Power MOSFETs at High Temperatures

机译：高温下1200 V碳化硅电源MOSFET的性能和可靠性表征
- 作者：R. J. Kaplar;D. R. Hughart;S. Atcitty;J. D. Flicker;S. DasGupta;M. J. Marinella
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
40.High Temperature 256Kbit (32Kbit × 8) HTEEPROM Reliability Testing

机译：高温256kbit（32kbit×8）HTEEPROM可靠性测试
- 作者：Joe G. Guimont;Bruce W. Ohme
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- High-temperature electronics;
- EEPROM;
- Reliability;
- SOI CMOS;
- Non-volatile Memory;
41.The European SEEL (Solutions for energy efficient lighting) project: High temperature electronics for LED-lighting architectures

机译：欧洲SEEL（节能照明的解决方案）项目：LED照明架构的高温电子产品
- 作者：S. Habenicht;H. J. Funke;D. Gruber;D. Oelgeschlager;O. Schumacher;R. Gehn;S. Walczyk;A. Mavinkurve;Th. Reiners;R. Fiederling
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
42.Packaging technologies for high temperature control electronics

机译：高温控制电子产品的包装技术
- 作者：Conor Slater;Radisav Cojbasic;Thomas Maeder;Yusuf Leblebici;Peter Ryser
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- High temperature packaging;
- CPUs and MCUs;
- Reliability;
43.Evaluation of Pressure Free Nanoparticle Sintered Silver Die Attach on Silver and Gold Surfaces

机译：无压纳米粒子烧结银模具的评价银和金表面
- 作者：G. Lewis;G. Dumas;S. H. Mannan
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
44.Communication system for down-hole measurement tools based on real-time SNR characterization in coaxial cable used as communication channel

机译：基于与通信通道的同轴电缆实时SNR表征的井下测量工具通信系统
- 作者：Rito Mijarez;David Pascacio;Ricardo Guevara;Olimpia Pacheco;Carlos Tello;Joaquin Rodriguez
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
45.KEMET SMD Film Capacitors for High Temperature Applications

机译：KEMET SMD薄膜电容器用于高温应用
- 作者：Luca Caliari;Paola Bettacchi;Evangelista Boni;Davide Montanari;Arrigo Gamberini;Luigi Barbieri;Francesco Bergamaschi
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- Drilling;
- Temperature;
- Capacitor;
- Current;
- Voltage;
- Automotive;
46.Enhanced High Temperature Performance of PD-SOI MOSFETs in Analog Circuits Using Reverse Body Biasing

机译：使用反向体偏置增强了模拟电路中的PD-SOI MOSFET的高温性能
- 作者：Alexander Schmidt;Holger Kappert;Rainer Kokozinski
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- SOI-CMOS;
- PD-SOI;
- FD-SOI;
- High Temperature;
- G_m=I_d;
- Intrinsic Gain;
- Leakage Currents;
47.Reliability of Au-Ti for High Temperature Termination on Ferrite LTCC Inductors

机译：铁氧体LTCC电感器高温终端AU-TI的可靠性
- 作者：James Galipeau
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- Termination Reliability;
- Ferrite LTCC Magnetics;
- Au-Ti;
48.Novel encapsulation materials for High Pressure-High Temperature (HPHT) applications

机译：高压高温（HPHT）应用的新型封装材料
- 作者：Eric Jian Rong Phua;Ming Liu;Riko I. Made;Liying Zhang;Chee Cheong Wong;Zhong Chen;Min Woo Rhee;Xiao Hu;Chee Lip Gan
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- Encapsulation;
- HPHT;
- Thermoset polymer resin;
49.Advanced Applications of High Temperature Magnetics

机译：高温磁性的先进应用
- 作者：John R. Fraley;Edgar Cilio;Bryon Western
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- High temperature;
- Magnetics;
- Sensors;
- Novel device;
- Saturable reactor;
- Extreme environment;
- Current sensor;
50.POL and LDO for Harsh Environment Applications

机译：POL和LDO用于恶劣环境应用
- 作者：Ramesh Khanna;Srinivasan Venkataraman
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- DC-DC Power Conversion;
- MOSFETs;
- High Temperature;
- Controller;
- Current mode control;
- LDO;
51.LT-TLPS Die Attach for High Temperature Electronic Packaging

机译：LT-TLPS模具安装高温电子包装
- 作者：Hannes Greve;F. Patrick McCluskey
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
52.A 4H-SiC Bipolar Technology for High-temperature Integrated Circuits

机译：高温集成电路的4H-SiC双极技术
- 作者：L. Lanni;B. G. Malm;C. M. Zetterling;M. Oerstling
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
53.Silicon Capacitors with extremely high stability and reliability ideal for high temperature applications

机译：硅电容器具有极高的稳定性和可靠性，适用于高温应用
- 作者：Catherine Bunel;Laurent Lengignon
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- High-density Silicon capacitors;
- Decoupling capacitors;
- Passive integration;
- High reliability;
- High stability;
- PICS;
54.1200 V SiC Schottky Rectifiers optimized for ≥ 250°C operation with low junction capacitance

机译：1200 V SiC舒张整流器优化≥250°C，具有低结电容
- 作者：Ranbir Singh;Siddarth Sundaresan
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
55.A High Temperature, Frequency Output Silicon Temperature Sensor

机译：高温，频率输出硅温传感器
- 作者：Shane Rose;Mark Hahn
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- Temperature Sensor;
- CMOS;
- High Temperature Electronics;
56.A High Temperature, Fast Switching SiC Multi-chip Power Module (MCPM) for High Frequency (> 500 kHz) Power Conversion Applications

机译：高频，快速切换SIC多芯片电源模块（MCPM），用于高频（> 500 kHz）电源转换应用
- 作者：Z. Cole;B. S. Passmore;B. Whitaker;A. Barkley;T. McNutt;A. B. Lostetter
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- Silicon Carbide (SiC);
- High Temperature Power Electronics Packaging;
- High Frequency;
- Multi-Chip Power Modules;
57.A 250°C ASIC Technology

机译：250°C ASIC技术
- 作者：Lynn Reed
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
58.Precise Chip Joint Method with Sub-micron Au Particle for High-density SiC Power Module Operating at High Temperature

机译：具有高温操作的高密度SiC电源模块亚微米Au粒子的精确芯片联合方法
- 作者：Fumiki Kato;Fengqun Lang;Simanjorang Rejeki;Hiroshi Nakagawa;Hiroshi Yamaguchi;Hiroshi Sato
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- Precise chip joint;
- Sub-micron Au particle;
- High-density SiC power module;
- High-temperature Operation;
59.Long Term Demonstrated Performance Characteristics for Improved High Temperature Ceramic Capacitors Intended for Use in Extreme, Harsh Environments

机译：长期显示出用于极端，恶劣环境的改进的高温陶瓷电容器的性能特性
- 作者：Mustafa A. Syammach;Mustapha Habibi;Fauzi A. Syammach
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- High-temperature;
- Capacitors;
- Performance characteristics;
- Packaging;
- Long Term;
- And Reliability;
60.Reliability of SiC Digital Telemetry Circuits on AlN Substrate

机译：ALN衬底上的SIC数字遥测电路的可靠性
- 作者：Reza Ghandi;Cheng-Po Chen;Liang Yin;Rich Saia;Tammy Johnson;Peter Sandvik;Kun Fang;R. Wayne Johnson
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- Silicon Carbide;
- Digital Telemetry;
- Geothermal;
- MOSFETs;
61.Reliability of wire-bonded electronic devices in combined high temperature and vibrational environments

机译：高温和振动环境中引线电子设备的可靠性
- 作者：M. Mirgkizoudi;C. Liu;P. Conway;S. Riches
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- Wire bonding;
- High temperature applications;
- Reliability;
- Vibration testing;
62.The Thermal Integrity of Integrated GaN Power Modules

机译：集成GaN电源模块的热完整性
- 作者：J. Roberts;T. MacElwee;L. Yushyna
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- Gallium nitride (GaN);
- High power;
- And high temperature;
63.Demonstration of a 300°C Capable Directional Drilling Steering Tool (DM300)

机译：300°C的方向钻孔转向工具的演示（DM300）
- 作者：D. MacGugan
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- Silicon-on-Insulator;
- Directional drilling;
- Flux-gate magnetometers;
- MEMS accelerometers;
64.Effectiveness of Barrier Layer Metallisations in Long Term High Temperature Endurance Tests on Wire Bond Interconnections

机译：在线键合互连长期高温耐久性测试中阻挡层金属化的有效性
- 作者：S. T. Riches;C. Johnston;A. Lui
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- Silicon-on-Insulator devices;
- High temperature electronics packaging;
- Intermetallics;
- Wire bonding;
65.High Temperature Reliability Investigations up to 350°C of Gate Oxide Capacitors realized in a Silicon-on-Insulator CMOS-Technology

机译：高温可靠性调查高达350°C在绝缘体上实现的栅极氧化物电容器在绝缘体上实现了CMOS技术
- 作者：K. Grella;S. Dreiner;H. Vogt;U. Paschen
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- Silicon-on-Insulator (SOI);
- Oxide Reliability;
- Time-Dependent Dielectric Breakdown (TDDB);
66.High temperature, Smart Power Module for aircraft actuators

机译：用于飞机执行器的高温，智能电源模块
- 作者：Khalil EL FALAHI;Stanislas HASCOET;Cyril BUTTAY;Pascal BEVILACQUA;Luong-Viet PHUNG;Dominique TOURNIER;Bruno ALLARD;Dominique PLANSON
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- Power electronics;
- SiC;
- SOI;
- Power module;
67.Precision Analog Signal Conditioning Semiconductors for Operation in Very High Temperature Environments

机译：适用于超高温环境的精密模拟信号调节半导体
- 作者：Michael Arkin;Jeff Watson;Michael Siu;Michael Cusack
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- High Temperature Electronics;
- Signal Conditioning;
- Semiconductors;
- Operational Amplifier;
- Voltage Reference;
68.Multi-bit memory cell using long-range non-anchored actuation for high temperature applications

机译：用于高温应用的多位存储单元，采用远程非锚定驱动
- 作者：Mehrdad Elyasi;Chengkuo Lee;Cheng-Yu Hsieh;Dim-Lee Kwong
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
69.Evaluation of Refractory Metals for Package Level Interconnection in a Harsh Environment

机译：恶劣环境下封装级互连用难熔金属的评估
- 作者：Riko I. Made;Eric Jian Rong Phua;Key Wen Tan;Wei Chuan Ong;Clare Guanqi Huang;Hock Guan Ong;Vivek Chidambaram Nachiappan;Chee Cheong Wong;Chen Zhong;Chee Lip Gan
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- Interconnection;
- High temperature;
- High pressure;
- Electrical;
- Resistance;
- Adhesion;
70.Advanced Ceramic Capacitor Solutions for High Temperature Applications

机译：适用于高温应用的高级陶瓷电容器解决方案
- 作者：Abhijit Gurav;Xilin Xu;Jim Magee;Paul Staubli;John Bultitude;Travis Ashburn
- 会议名称：《IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics Network》 | 2013年
- High temperature capacitor;
- Ceramic Capacitor;
- BME MLCC;
- C0G;