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SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices

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1.Low-cost System for Testing MEMS for Research and Educational Applications

机译：用于测试研究和教育应用的MEMS的低成本系统
- 作者：Gabriel Ramirez;Ganapathy Sivakumar;Shelby Lacouture;Tim Dallas
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- MEMS;
- education;
- microdevices;
- control electronics;
2.Temperature measurement on MOEMS micromirror plates under illumination

机译：照明下MOEMS微镜板上的温度测量
- 作者：Ingo Wullinger;Dirk Rudloff;Klaus Lukat;Peter Durr;Mathias Krellmann;Detlef Kunze;Aravind Narayana Samy;Ulrike Dauderstadt;Michael Wagner
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- SLM;
- MOEMS;
- high intensities;
- mirror array;
- heat;
3.Characterization of polymeric getter materials for MEMs/MOEMS and other microelectronic package service

机译：用于MEMS / MEMS和其他微电子包装的聚合物吸气剂材料的特征
- 作者：Richard C. Kullberg;Bradley L. Phillip
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- polymer getter desiccant ionics sorption hydrogen water gravimetric MIL-STD-883;
4.Lifetime estimation and reliability study of Electro-thermal MEMS actuators

机译：电热MEMS执行器的寿命估计与可靠性研究
- 作者：Ganapathy Sivakumar;Stephen Johns;Jesus A. Nava;Tim Dallas
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- reliability;
- lifetime;
- electrothermal actuator;
- chevron actuator;
5.Remotely Accessible Laboratory for MEMS Testing

机译：用于MEMS测试的远程访问实验室
- 作者：Ganapathy Sivakumar;Matthew Mulsow;Aaron Melinger;Shelby Lacouture;Tim E. Dallas
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- remote instrumentation;
- MEMS;
- education;
6.SELF ALIGNED MASKLESS PROCESS FOR ETCHING CAVITIES IN SOI WAFERS TO ENHANCE THE QUALITY FACTOR OF MEMS RESONATORS

机译：用于SOI晶片中的蚀刻空腔的自对子掩模方法，以提高MEMS谐振器的质量因子
- 作者：Wajihuddin Mohammad;Ville Kaajakari
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- SOI wafers;
- MEMS resonators;
- cavity;
- quality factor;
7.A 2-DOF MEMS Positioning System

机译：A 2-DOF MEMS定位系统
- 作者：Ganapathy Sivakumar;James Mathews;Tim E. Dallas
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- micro-positioning;
- nano-positioning;
- comb-drive;
- cross-talk;
- compliant mechanism;
8.Nanoengineered surfaces for microfluidic-based thermal management devices

机译：基于微流体的热管理装置的纳米工程表面
- 作者：Evelyn N. Wang;Rong Xiao;Kuang-Han Chu
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- thermal management;
- nanoengineered surfaces;
- electronics cooling;
- microfluidics;
- heat sink;
9.The influence of the arrangement and spacing of CNT column array on the characteristic of field emission

机译：CNT柱阵列布置和间距对场发射特性的影响
- 作者：Kyusung Han;Dohan Jun;Nguyen Tuan Hong;Sooonil Lee;SangSik Yang
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- Carbon nanotube;
- field emission;
- field screening effect;
- time-of-flight mass spectrometer;
10.Performance and Reliability Assessment of a Dielectric Charging Guard in MEMS Optical Switch Systems

机译：MEMS光开关系统中电介质充电卫卫的性能和可靠性评估
- 作者：Ping Zhang;Emily Can;Doug Keebaugh;Kelvin Chau
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- MEMS Optical Switch;
- MOEMS;
- Reliability;
- Dielectric Charging;
- Isolation;
11.Emerging Research in Micro and Nano Systems: Opportunities and Challenges for Societal Impact

机译：微型和纳米系统的新兴研究：社会影响的机遇和挑战
- 作者：Yogesh B. Gianchandani
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- environmental sensing;
- health care;
- infrastructure monitoring;
- energy;
- power;
12.Shaping Light: MOEMS Deformable Mirrors for Microscopes and Telescopes

机译：塑造灯：MOEMS可变形镜用于显微镜和望远镜
- 作者：Thomas Bifano
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- Adaptive Optics;
- MEMS;
- MOEMS;
- Deformable Mirrors;
13.Development of Microlens Array (MLA) for Maskless Photolithography Application

机译：用于无掩模光刻应用的微透镜阵列（MLA）的开发
- 作者：Minwoo Nam;Haekwan Oh;Geunyoung Kim;Sangsik Yang;Keekeun Lee
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- Maskless photolithography;
- Microlens array (MLA);
- Quartz;
- UV curable polymer;
- Isotropic wet etching;
14.Stability Experiments on MEMS Aluminum Nitride RF Resonators

机译：MEMS氮化物RF谐振器上的稳定性实验
- 作者：Danelle M. Tanner;Roy H. Olsson III;Ted B. Parson;Shannon M. Crouch;Jeremy A. Walraven;James A. Ohlhausen
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- MEMS RF Resonators;
- MEMS Reliability;
- Resonator Stability;
15.Packaged bulk micromachined Triglyceride biosensor

机译：包装散装微加基甘油三酯生物传感器
- 作者：Mohanasundaram S V;Mercy S;Harikrishna P V;Kailash Rani;Enakshi Bhattacharya;Anju Chadha
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- Biosensor;
- EISCAP;
- miniaturization;
- packaging;
- triglyceride;
- anodic bonding;
- adhesive bonding;
16.Investigation into Metamaterial Structures Operating at Terahertz Wavelength

机译：在太赫兹波长下运行的超材料结构的调查
- 作者：Derrick Langley;Ronald A. Coutu Jr.;LaVern A. Starman;Michael A. Marciniak
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- metamaterial;
- negative refractive index;
- fabrication;
- terahertz wavelength;
17.Mitigating the irreversible deformation with pressure in silicon /porous silicon composite membranes

机译：用硅/多孔硅复合膜压力减轻不可逆变形
- 作者：L. Sujatha;Rahul Goswami;Enakshi Bhattacharya
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- Pressure sensor;
- porous silicon deformation;
- composite membrane;
- stiction;
- SAM;
18.Predicting Reliability of Silicon MEMS

机译：预测硅MEMS的可靠性
- 作者：Alissa M. Fitzgerald;David M. Pierce;Benedikt Zeyen
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- MEMS reliability;
- fracture prediction;
- failure analysis;
- Weibull analysis;
- brittle fracture;
- deep reactive ion etching;
- fracture strength;
- silicon;
19.Development and Testing of a Multi-Level Chevron Actuator Based Positioning System

机译：基于多级雪佛龙执行器的定位系统的开发和测试
- 作者：Sandesh Rawool;Ganapathy Sivakumar;Johan Hendriske;Daniel Buscarello;Immanuel Purushothaman;Tim E. Dallas
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- micro-actuators;
- micro-positioning;
- electro-thermal;
20.Engineered Nanowires, Carbon Nanotubes and Graphene for Sensors, Actuators and Electronics

机译：用于传感器，执行器和电子器件的工程纳米线，碳纳米管和石墨烯
- 作者：E . H . Y a n g
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- engineering;
- harvesting;
- measurement;
21.Reliability Study of a MEMS Array Under Varying Temperature and Humidity

机译：变化温度和湿度下MEMS阵列的可靠性研究
- 作者：Ganapathy Sivakumar;Ranjith Ranganathan;Richard Gale;Tim Dallas
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- stiction;
- reliability;
- Weibull;
- humidity;
- self-assembled monolayer;
22.Wafer-level vacuum/hermetic packaging technologies for MEMS

机译：MEMS的晶圆级真空/密封包装技术
- 作者：Sang-Hyun Lee;Jay Mitchell;Warren Welch;Sangwoo Lee;Khalil Najafi
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- MEMS;
- packaging;
- solder;
- eutectic;
- wafer-level;
- vacuum;
- hermetic;
- feedthrough;
23.Pressure sensing in vacuum hermetic micropackaging for MOEMS-MEMS

机译：MoEMS-MEMS真空密封微包中的压力传感
- 作者：Marco Michele Sisto;Sonia Garcia-Blanco;Loic Le Noc;Bruno Tremblay;Yan Desroches;Jean-Sol Caron;Francis Provencal;Francis Picard
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- vacuum hermetic packaging;
- wafer-level-packaging;
- pressure sensing;
- MOEMS;
- MEMS;
24.Thermal microactuator performance as a function of mechanical stress

机译：热微致动器性能作为机械应力的函数
- 作者：Leslie M. Phinney;Matthew A. Spletzer;Michael S. Baker;Justin R. Serrano
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- Thermal microactuator;
- mechanical stress effects;
- MEMS packaging;
- four-point bending stage;
25.Optimal design of SAW-based gyroscope to improve the sensitivity

机译：锯基陀螺仪提高敏感性的最佳设计
- 作者：Haekwan Oh;Sangsik Yang;Keekeun Lee
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- Coriolis force;
- Couple of mode (COM);
- Progressive wave;
- SAW gyroscope;
- SAW oscillator;
26.A New Method For Hermeticity Testing of Wafer-Level packaging

机译：一种新的晶圆级包装的密封性测试方法
- 作者：Djemel Lellouchi;Jeremie Dhennin;Xavier Lafontan;David Veyrie;Adrien Broue;Jean-Francois Le Neal;Francis Pressecq
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- Hermeticity;
- MEMS;
- wafer-level packaging;
- helium leak test;
- reliability;
27.Modeling time-dependent dielectric breakdown with and without barriers

机译：用屏障建模时间依赖介电故障
- 作者：J.L. Plawsky;W.N. Gill;R.S. Achanta
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- Dielectric breakdown;
- time to failure;
- reliability;
- copper injection;
28.Use of Conductive Adhesive for MEMS Interconnection in Military Fuze Applications

机译：在军事引信应用中使用导电粘合剂MEMS互连
- 作者：Jakob Gakkestad;Per Dalsjo;Helge Kristiansen;Rolf Johannessen;Maaike M Visser Taklo
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- Conductive adhesive;
- fuze;
- MEMS;
- packaging;
- reliability;
- polymer spheres;
29.Hermetic vacuum sealing of MEMS devices containing organic components

机译：含有有机组分的MEMS器件的密封性
- 作者：Gary B. Tepolt;Mark J. Mescher;John J. LeBlanc;Robert Lutwak;Mathew Varghese
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- Hermetic;
- seal;
- CSAC;
- outgassing;
- IVA;
- epoxy;
30.Novel test fixture for collecting microswitch reliability data

机译：用于收集微型开关可靠性数据的新型测试夹具
- 作者：Thomas A. Edelmann;Ronald A. Coutu Jr.;LaVern A. Starman
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- MEMS;
- microswitch;
- contacts;
- reliability;
31.The effects of plasma pretreatment and storage time on silicon fusion bonding

机译：等离子预处理和储存时间对硅熔接的影响
- 作者：Chad B. ONeal;Joel Soman
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- silicon wafer bonding;
- plasma enhanced;
- fusion bonding;
32.Optical inspection of MOEMS devices using a configurable and suitable for production image processing system

机译：使用可配置和适用于生产图像处理系统的MoEMS器件的光学检查
- 作者：M. Scholles;M. Grafe;P. Miskowiec;V. Bock;H. Schenk
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- MEMS;
- optical inspection;
- characterization;
- scanning mirror;
- image processing;
33.Characterization of Au/Au, Au/Ru and Ru/Ru ohmic contacts in MEMS switches improved by a novel methodology

机译：MEMS开关中的AU / AU，AU / Ru和Ru / Ru / Ru / Ru / Ru / Ru / Ru / Ru / Ru / Ru欧姆触点的表征改善了新方法
- 作者：Adrien Broue;Jeremie Dhennin;Frederic Courtade;Christel Dieppedale;Patrick Pons;Xavier Lafontan;Robert Plana
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- MEMS;
- Switch;
- Micro contact;
- Contact material;
- Contact temperature;
- Creep;
- Gold;
- Ruthenium;
34.MEMS TECHNOLOGIES FOR ARTIFICIAL RETINAS

机译：人工视网膜的MEMS技术
- 作者：Wilfried Mokwa
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- retina implant;
- epiretinal;
- subretinal;
- mems;
- artificial retina;
- electrical stimulation;
35.MEMS/Microfluidics Packaging Without Heating

机译：MEMS / Microfluidics包装不加热
- 作者：Matiar R.Howlader
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
36.Reliability Assessment of Ceramic Column Grid Array (CCGA717)Interconnect Packages under Extreme Temperatures For Space Applications (-185°C to +125°C)

机译：陶瓷柱网格阵列的可靠性评估（CCGA717）在空间应用的极端温度下互连包装（-185°C至+ 125°C）
- 作者：Rajeshuni Ramesham
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2010年
- Extreme temperatures;
- CCGA qualification;
- CCGA reliability;
- Weibull analysis;
- shape parameters;
- solder joint failures;
- etc;
37.High-temperature compatible 3D-integration processes for a vacuum-sealed CNT-based NEMS

机译：用于真空密封的基于CNT的NEM的高温兼容3D集成工艺
- 作者：R. Gueye;S.W. Lee;T. Akiyama;D. Briand;C. Roman;C. Hierold;N. F. de Rooij
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2013年
38.MEMS and MOEMS resonant frequencies analysis by Digital Holography Microscopy (DHM)

机译：MEMS和MOEMS谐振频率分析数字全息显微镜（DHM）
- 作者：Y. Emery;E. Solanas;N. Aspert;A. Michalska;J. Parent;E. Cuche
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2013年
- MEMS analyzer;
- frequency analysis;
- resonance characterization;
- Bode diagrams;
39.Reliability of MEM relays for zero leakage logic

机译：零泄漏逻辑的MEM继电器的可靠性
- 作者：Yenhao Chen;Rhesa Nathanael;Jack Yaung;Louis Hutin;Tsu-Jae King Liu
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2013年
- MEM-relay;
- Micro-electro-mechanical;
- Reliability;
- Contact Stability;
40.Temperature compensated silicon resonators for space applications

机译：用于空间应用的温度补偿硅谐振器
- 作者：Mina Rais-Zadeh;Vikram A. Thakar;Zhengzheng Wu;Adam Peczalski
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2013年
- Clocks;
- flexural mode resonator;
- micromechanical resonators;
- TCF;
- temperature compensated;
- timing units;
- quality factor;
41.Reliability studies on MEMS shutters and displays

机译：MEMS百叶窗和显示器的可靠性研究
- 作者：Joyce H. Wu;J. Lodewyk Steyn
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2013年
- MEMS;
- shutter;
- display;
- reliability;
- shock test;
- drop test;
- vibration test;
- press test;
42.Effects of actuation methods and temperature on adhesion force between polycrystalline silicon surfaces in MEMS

机译：致动方法和温度对MEMS多晶硅表面粘附力的影响
- 作者：M. Shavezipur;C. Carraro;R. Maboudian
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2013年
- Adhesion force;
- electrostatic actuation;
- capacitive readout;
- high temperature;
43.Reliability characteristics of microfabricated Rb mini-lamps for optical pumping in miniature atomic clocks and magnetometers

机译：微型射流型微型射流用于微型原子钟和磁力计的光学泵浦的可靠性特性
- 作者：Vinu Venkatraman;Yves Pétremand;Nico de Rooij;Herbert Shea
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2013年
- dielectric barrier discharge;
- rubidium;
- double resonance;
- atomic clock;
- plasma discharge;
- lifetime;
44.Robustness and reliability of MOEMS for miniature spectrometers

机译：微型光谱仪MOEMS的鲁棒性和可靠性
- 作者：A. Rissanen;M. Broas;J. Hokka;T. Mattila;J. Antila;M. Laamanen;H. Saari
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2013年
- Fabry-Perot interferometer;
- MOEMS;
- miniature spectrometers;
- nanosatellite;
45.Solar cell packaged by a microlens array and its long-term optical efficiency enhancement

机译：由微透镜阵列包装的太阳能电池及其长期光学效率增强
- 作者：Minwoo Nam;Kangho Kim;Jaejin Lee;Sang Sik Yang;Kee-Keun Lee
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2013年
- Microlens array (MLA);
- GaAs-based Solar cell;
- Optical shading loss;
- Sunlight micro-manipulation;
- Solar cell packaging;
46.Wafer level vacuum packaging of scanning micro-mirrors using glass-frit and anodic bonding methods

机译：使用玻璃料和阳极粘合方法扫描微镜的晶片水平真空包装
- 作者：S. Langa;C. Drabe;C. Kunath;A. Dreyhaupt;H. Schenk
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2013年
- Green Photonics;
- Wafer Level Vacuum Packaging;
- Micro-mirrors;
- Wafer Bonding;
- Energy efficiency;
- Glass frit;
- anodic bonding;
47.A smaller footprint MEMS sensor for on-chip temperature measurement

机译：用于片上温度测量的较小占地面积传感器
- 作者：A. Najafi Sohi;P. Nieva;A. Khajepour
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2013年
- MEMS;
- temperature sensor;
- bimaterial plate;
- linearity;
- sensitivity;
48.MEMS accelerometers utilizing resonant microcantilevers with interrogated single-mode waveguides and Bragg gratings

机译：MEMS加速度计利用具有询问单模波导和布拉格光栅的谐振微膜剂
- 作者：L. G. Carpenter;C. Holmes;J. C. Gates;P. G. R. Smith
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2013年
- microcantilever;
- Bragg gratings;
- planar integrated optics;
- accelerometer;
49.MEMS gratings for wavemeters and tunable light sources

机译：用于波模和可调谐光源的MEMS光栅
- 作者：Maurizio Tormen;Thomas Overstolz;Stéphan Dasen;Jacques-André Porchet;Réal Ischer;Branislav Timotijevic;Ross Stanley
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2013年
- MOEMS;
- Optical MEMS;
- Wavemeter;
- Tunable source;
- Spectrometer;
- Tunable blazed gratings;
- MEMS gratings;
- Tunable Quantum Cascade Laser;
50.Optoelectronic and acoustic properties and their interfacial durability of GnP/PVDF/GnP composite actuators with nano-structural control

机译：具有纳米结构控制的GNP / PVDF / GNP复合致动器的光电和声学及其界面耐久性
- 作者：Joung-Man Park;Dong-Jun Kwon;Zuo-Jia Wang;Ga-Young Gu;Lawrence DeVries
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2013年
- coating;
- durability;
- drying temperature;
- wettability;
51.Developments in packaging and integration for silicon photonics

机译：硅光子硅包装与集成的发展
- 作者：Bradley W. Snyder;Peter A. OBrien
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2013年
- silicon photonics;
- optical interconnects;
- packaging;
52.Making MEMS more suited for Space: assessing the proton-radiation tolerance of structural materials for microsystems in orbit

机译：制作MEMS更适合空间：评估轨道中微系统的结构材料的质子 - 辐射耐受性
- 作者：Tobias Bandi;Jo?o Polido-Gomes;Antonia Neels;Alex Dommann;Herbert R. Shea
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2013年
- Silicon;
- SU-8;
- Microelectromechanical systems (MEMS);
- Radiation effects;
- Young's modulus;
- Accelerated aging;
- Material reliability;
53.Influence of ceramic package internal components on the performance of vacuum sealed uncooled bolometric detectors

机译：陶瓷包装内部成分对真空密封的辐射探测器性能的影响
- 作者：Alex Paquet;Sébastien Deshaies;Yan Desroches;Jeff Whalin;Patrice Topart
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2013年
- hermetic vacuum packaging;
- bolometers;
- MEMS;
- non-evaporable getter;
54.Analysis of metal-metal contacts in RF MEMS switches

机译：RF MEMS开关中金属 - 金属触点分析
- 作者：Steffen Kurth;Sven Voigt;Sven Haas;Andres Bertz;Christian Kaufmann;Thomas Gessner;Akira Akiba;Koichi Ikeda
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2013年
- RF-switch;
- MEMS;
- metal-metal contact;
- reliability;
- IP3;
55.Spaceborne linear arrays of 512×3 microbolometers

机译：512×3微压计的星载线性阵列
- 作者：Linh Ngo Phong;Ovidiu Pancrati;Linda Marchese;Fran?ois Chateauneuf
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2013年
- linear array format;
- microbolometer;
- readout electronics;
- multispectral imager;
- radiometric calibration;
56.Impact of radiations on the electromechanical properties of materials and on the piezoresistive and capacitive transduction mechanisms used in microsystems

机译：微辐射对材料机电性能的影响以及微系统中使用的压阻和电容转导机制
- 作者：Laurent A. Francis;Petros Gkotsis;Valeriya Kilchytska;Xiaohui Tang;Sylvain Druart;Jean-Pierre Raskin;Denis Flandre
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2013年
- MEMS;
- radiation effects;
- reliability;
- sensors;
57.Life testing of reflowed and reworked advanced CCGA surface mount packages in harsh thermal environments

机译：在苛刻的热环境中回流和重新加工高级CCGA表面贴装的寿命测试
- 作者：Rajeshuni Ramesham Ph.D.
- 会议名称：《SPIE Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices》 | 2013年