首页>外文会议>其他>IEEE International Semiconductor Manufacturing Conference

IEEE International Semiconductor Manufacturing Conference

召开年：
召开地：
出版时间：-

会议文集：-

会议论文

热门论文

全部论文

全选（0）

1.Lithography in a 300 mm pilot production line

机译：300毫米试点生产线的光刻
- 作者：Ganz D.;Charles A.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE International Semiconductor Manufacturing Conference》 | 1999年
2.Capital equipment reuse: from strategy to execution

机译：资本设备重用：从战略执行
- 作者：Weisberg P.;Rigoni J.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE International Semiconductor Manufacturing Conference》 | 1999年
3.Inspection optimization for excursion and baseline defect monitoring in a manufacturing environment

机译：在制造环境中的游览和基线缺陷监测的检查优化
- 作者：Sajoto D.;Gordon A.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE International Semiconductor Manufacturing Conference》 | 1999年
4.Advanced defect-kill-rate estimation and yield analysis incorporating defect clustering

机译：结合缺陷聚类的高级缺陷杀戮速率估计和产量分析
- 作者：Kikuchi H.;Nishio N.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE International Semiconductor Manufacturing Conference》 | 1999年
5.Advanced process control system description of an easy-to-use control system incorporating pluggable modules

机译：高级过程控制系统描述包括可插拔模块的易于使用的控制系统
- 作者：Fukuda E.;Harakawa S.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE International Semiconductor Manufacturing Conference》 | 1999年
6.Reclamation of waste mixture of sulfuric acid and hydrogen peroxide used to clean semiconductor wafers

机译：用于清洁半导体晶片的废物和过氧化氢废料混合物的回收
- 作者：Inagaki Y.;Nishizaki M.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE International Semiconductor Manufacturing Conference》 | 1999年
7.Development of a novel air-back wafer carrier with an integrated endpoint detector for copper CMP application

机译：具有用于铜CMP应用的集成终点检测器的新型空压晶圆载波的开发
- 作者：Sakai K.;Doy T.K.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE International Semiconductor Manufacturing Conference》 | 1999年
8.IC performance prediction for test cost reduction

机译：IC性能预测测试成本降低
- 作者：Jungran Lee;Walker D.M.H.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE International Semiconductor Manufacturing Conference》 | 1999年