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High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on

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1.Studies on design, fabrication and reliability assessment of embedded passives on a high-density interconnect (HDI) organic substrate using a sequential build-up process

机译：使用顺序构建工艺研究高密度互连（HDI）有机衬底上嵌入式无源器件的设计，制造和可靠性评估
- 作者：Varadarajan M.G.;Lee K.J.;Bhattacharya S.K.;Bhattacharjee A.;Lixi Wan;Pucha R.;Tummala R.R.;Sitaraman S.
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
2.Integration of a 5-GHz radio front-end in PCB

机译：在PCB中集成5 GHz无线电前端
- 作者：Shaofang Gong;Backstrom A.;Agesjo M.;Serban A.;Karlsson M.
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
3.Design and implementation of a high efficient power converter for self-powered UHF RFID applications

机译：用于自供电UHF RFID应用的高效功率转换器的设计和实现
- 作者：Chen C.;Nejad M.B.;Li-Rong Zheng
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
4.A comprehensive finite element model for simulating reflow profile of a BGA package

机译：一个全面的有限元模型，用于模拟BGA封装的回流曲线
- 作者：Shen Liang;Wang Mingxiang;He YongHong;Lam Tim Fai;Jiang YuQi
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
5.Design and development of thermal-mechanical solutions for a community personal computer

机译：社区个人计算机的热机械解决方案的设计和开发
- 作者：Zhou D.;Tze Yang Hin;Keat Ghee Tan;Boon Howe Oh
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
6.Overview of recent advances on isotropic conductive adhesives

机译：各向同性导电胶的最新进展概述
- 作者：Lu D.D.;Wong C.P.
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
7.Newly developed LCP solvent casting film and its applications

机译：最新开发的LCP溶剂流延膜及其应用
- 作者：Okamoto S.
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
8.High thermally conductive and high reliability under-fill

机译：高导热性和高可靠性底部填充
- 作者：Yukinari Abe;Kazuyoshi Yamada;Nobuyuki Abe;Fumio Tanaka;Tatsuhiro Fujiki
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
9.An improved method of endpoints detection based on energy-frequency-value

机译：一种基于能量-频率-值的端点检测的改进方法
- 作者：Chen Guanghua;Liu Junhai;Ye Jun
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
10.Checking causality of interconnects through minimum-phase and all-pass decomposition

机译：通过最小相位和全通分解检查互连的因果关系
- 作者：Bao Shu Xu;Xiang Yin Zeng;Jiangqi He;Dong-ho Han
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
11.Effect of bonding parameters on thermosonic flip chip bonding under pressure constraint pattern

机译：压力约束模式下键合参数对热超声倒装芯片键合的影响
- 作者：Fuliang Wang;Junhui Li;Lei Han;Jue Zhong
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
12.Failure analysis of the CdZnTe detector electrode contacts

机译：CdZnTe检测器电极触点的故障分析
- 作者：Teng Jianyong;Sang Wenbin;Qin Kaifeng;Min Jiahua;Xia Jun
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
13.Effects of thermosonic bonding parameters on flip chip LEDs

机译：热超声键合参数对倒装芯片LED的影响
- 作者：Kun Zhao;Lei Jia;Jian Duan;Jianhua Zhanga
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
14.Nanopackaging: nanotechnologies and electronics packaging

机译：纳米包装：纳米技术和电子包装
- 作者：Morris J.E.
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
15.Design, manufacture and testing of microengineered stencils used for sub 100 micron wafer level bumping

机译：设计，制造和测试用于100微米以下晶圆级隆起的微工程模具
- 作者：Gorman N.J.;Kay R.W.;Roney I.;Desmulliez M.P.Y.
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
16.Modeling and identification of a sub-mini helicopter

机译：小型直升机的建模与识别
- 作者：Liang Liu;Weilong Zheng;Li Chen
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
17.Development and prototyping of a HB-LED array module for indoor solid state lighting

机译：用于室内固态照明的HB-LED阵列模块的开发和原型设计
- 作者：Lee S.W.R.;Lau C.H.;Chan S.P.;Ma K.Y.;Ng M.H.;Ng Y.W.;Lee K.H.;Lo J.C.C.
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
18.Design for embedded chinese display smart card

机译：嵌入式中文显示智能卡的设计
- 作者：Hua Zhou;Yang Liu;Kolev D.A.;Jingjing Chen;Zonghe Lai;Johan Liu
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
19.Tin whisker growth under cycling current pulse

机译：循环电流脉冲下锡晶须的生长
- 作者：Bo Jiang;Ai-Ping Xian
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
20.IC fillet-lifting mechanism on wave soldering after reflow soldering

机译：回流焊后波峰焊的IC圆角提升机构
- 作者：Izuta G.;Tanabe T.;Murai J.;Murakami M.;Suganuma K.
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
21.Lead free solder bump manufacturing with IBM's C4NP process

机译：采用IBM C4NP工艺的无铅焊料凸点制造
- 作者：Laine E.;Ruhmer K.;Perfecto E.;Longworth H.;Hawken D.
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
22.Reliability of fine pitch Sn-3.8Ag-0.7Cu flip chip solder joints with different connection pads

机译：具有不同连接焊盘的小间距Sn-3.8Ag-0.7Cu倒装芯片焊点的可靠性
- 作者：Dezhi Li;Changqing Liu;Conway P.P.
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
23.Effect of bonding pressure on transducer ultrasonic propagation in thermosonic flip chip bonding

机译：键合压力对热超声倒装片键合中换能器超声传播的影响
- 作者：Long Zhili;Han Lei;Wu Yunxin;Zhong Jue
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
24.Silver migration control in electrically conductive adhesives

机译：导电胶中的银迁移控制
- 作者：Yi Li;Wong C.P.
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
25.Modeling and reliability analysis of lead-free solder joints of bottom leaded plastic (BLP) package

机译：底部铅塑料（BLP）封装的无铅焊点建模和可靠性分析
- 作者：Chen Xiangyang;Zhou Dejian
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
26.Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion au surface finish after reflow soldering

机译：在回流焊后化学镀Ni（P）浸入或表面光洁度良好的Sn-Co-Cu，Sn-Ag-Cu和共晶Sn-Cu焊点中形成金属间化合物
- 作者：Peng Sun;Andersson C.;Xicheng Wei;Zhaonian Cheng;Dongkai Shangguan;Liu J.
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
27.System-on-flexible-substrates: electronics for future smart-intelligent world

机译：柔性基板系统：面向未来智能智能世界的电子产品
- 作者：Li-Rong Zheng;Nejad M.B.;Rodriguez S.;Lu Zhang;Cairong Chen;Hannu Tenhunen
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
28.Nonlinear behaviors of transducer dynamics for thermosonic bonding

机译：热超声键合换能器动力学的非线性行为
- 作者：Lei Han;Jue Zhong
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
29.Low cycle fatigue of Sn-based lead-free solder joints and the analysis of fatigue life prediction uncertainty

机译：锡基无铅焊点的低周疲劳及疲劳寿命预测不确定性分析
- 作者：Andersson C.;Peng Sun;Johan Liu
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
30.Architecture research and VLSI implementation for discrete wavelet packet transform

机译：离散小波包变换的架构研究和VLSI实现
- 作者：XuMei-hua;Chen Zhang-jin;Ran Feng;Cheng Yu-lan
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
31.Design of an architecture for multiprocessor system-on-chip (MPSoC)

机译：多处理器片上系统（MPSoC）的体系结构设计
- 作者：Hu Yue-li;Ding Qian
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
32.High-speed board-to-board interconnects utilizing flexible foils and elastomeric connectors

机译：利用柔性箔和弹性连接器的高速板对板互连
- 作者：Huynh A.;Hakansson P.;Shaofang Gong;Odselius L.
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
33.Experimental identification of parasitic vibrations on ultrasonic bonding transducer

机译：超声键合传感器上寄生振动的实验识别
- 作者：Aijun Song;Han Lei;Han-Xiong Li
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
34.An innovative fully printable RFID technology based on high speed time-domain reflections

机译：基于高速时域反射的创新型完全可打印RFID技术
- 作者：Lu Zhang;Rodriguez S.;Tenhunen H.;Li-Rong Zheng
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
35.Experimental studies on bonding pressure in wire bonding

机译：引线键合中键合压力的实验研究
- 作者：Rongzhi Gao;Lei Han;Jue Zhong
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
36.Role of Cu contents in the isothermal metallurgical reaction for the flip chip Sn-3.0Ag-0.5 or 1.5Cu joints with Cu/electroless Ni-P/immersion Au bonding pad during aging

机译：铜含量在时效过程中含铜/化学镍-磷/浸金键合的倒装芯片Sn-3.0Ag- 0.5或1.5 Cu接头在等温冶金反应中的作用
- 作者：Guh-Yaw Jang;Jenq-Gong Dun;Su-Yueh Tsai;Chi-Rung Lee
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
37.Computer modeling of a micro-manufactured one-turn inductor

机译：微制造的单匝电感器的计算机建模
- 作者：Hua Lu;Flynn D.;Bailey C.;Desmulliez M.
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
38.Motherboard heat transfer modeling methodology

机译：主板传热建模方法
- 作者：Kar Mun Ng;Shah K.R.
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
39.Cooling challenges and best practices for high density data and telecommunication centers

机译：高密度数据和电信中心的散热挑战和最佳实践
- 作者：Wang D.
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
40.Laser soldering system calibration based on computer vision

机译：基于计算机视觉的激光焊接系统校准
- 作者：Xinjue Zou;Zhenhua Xiong;Yulin Wang;Han Ding
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
41.Design of an embedded on-chip debug support module of a MCU

机译：MCU的嵌入式片上调试支持模块的设计
- 作者：Hu Yue-li;Xiong Bing
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
42.A low-voltage bandgap reference with resistive subdivision

机译：带电阻细分的低压带隙基准
- 作者：Xu Xing;Wang Xichuan;Si Cuiying
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
43.Studies of electrical characteristics of wire bonder transducer by clamp condition and on/off of bonding tool

机译：通过钳位条件和键合工具的开/关研究引线键合传感器的电气特性
- 作者：Guang Mingan;Han Lei;Li Hanxiong
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
44.RF characterization of flip-chip anisotropic conductive adhesives joints

机译：倒装芯片各向异性导电胶接头的射频特性
- 作者：Xu Wang;Zhaonian Cheng;Johan Liu
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
45.Experimental optimization of process parameters for diode laser soldering of BGA

机译：BGA二极管激光焊接工艺参数的实验优化
- 作者：Yulin Wang;Zhenhua Xiong;Xinjue Zou;Han Ding
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
46.A novel structure for CdZnTe capacitive frisch grid radiation detector

机译：CdZnTe电容式微调网格辐射探测器的新型结构
- 作者：Qian Yongbiao;Sang Wenbin;Xia Jun;Min jiahua;Teng Jianyong;Liang Xiaoyan
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
47.Experimental research on compulsive cooling of swirling jet impingement

机译：旋流射流强制冷却实验研究。
- 作者：Yifeng Fu;Jiemin Zhou;Ying Yang
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
48.Simulation design of capacitive Frisch grid CdZnTe detectors

机译：电容式Frisch栅格CdZnTe探测器的仿真设计
- 作者：Xia Jun;Sang Wenbin;Qian Yongbiao;Min Jiahua;Teng Jianyong;Liang Xiaoyan
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
49.Analysis and application performance simulation of subband adaptive filtering structures

机译：子带自适应滤波结构分析及应用性能仿真
- 作者：Chen Guanghua;Ye Jun;Liu Junhai
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
50.Effect of Bi on the kinetics of intermetallics growth in Sn-3Ag-0.5Cu/Cu solder joint

机译：铋对Sn-3Ag-0.5Cu / Cu焊点中金属间化合物生长动力学的影响
- 作者：Jie Zhao;Lin Qi;Lai Wang
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
51.The growth behavior of intermetallic compound layers of Sn-3Ag / Cu and Sn/Cu joints during soldering and aging

机译：Sn-3Ag / Cu和Sn / Cu接头的金属间化合物层在焊接和时效过程中的生长行为
- 作者：Cong-qian Cheng;Peng Yang;Jie Zhao;Feng Zhu;Qing-Yang Song
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
52.Study of assembling ZnO nanowires on AFM tips

机译：在AFM尖端上组装ZnO纳米线的研究
- 作者：Hu Siyan;Sang Wenbin;Zhu Zhenghui;Wang Bin;Min Jiahua
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
53.Homogenization model based on micropolar theory for the interconnection layer in microsystem packaging

机译：基于微极性理论的微系统封装互连层均质化模型
- 作者：Yan Zhang;Larsson R.;Jing-yu Fan;Zhaonian Cheng;Johan Liu
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
54.On the heat transfer enhancement based on micro-scale air impinging jets with microstructure heat sink in electronics cooling

机译：电子冷却中基于微结构散热器的微型空气射流传热的研究
- 作者：Jing-yu Fan;Yan Zhang;Johan Liu
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
55.The effect of accelerated thermal cycle parameters and the geometry dimensions on solder joint reliability

机译：加速的热循环参数和几何尺寸对焊点可靠性的影响
- 作者：Bingting Hu;Jiemin Zhou;Ping Zhou;Ying Yang
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
56.Design and modeling challenges for high density packaging

机译：高密度包装的设计和建模挑战
- 作者：Bailey C.
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
57.Research on manufacturing execution system for the SMT industry

机译：SMT行业制造执行系统研究
- 作者：Chen Dongfan;Zhou Lincan
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
58.Hybrid interconnects using silicon/FR-4 substrates for board-level 10 Gb/s signal broadcasting

机译：使用硅/ FR-4基板的混合互连，用于板级10 Gb / s信号广播
- 作者：Yin-Jung Chang;Guidotti D.;Lixi Wan;Gee-Kung Chang
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
59.Fracture surface analysis of aged and drop tested Sn-Ag-Cu solder joints

机译：老化和跌落测试的Sn-Ag-Cu焊点的断裂表面分析
- 作者：Monlevade E.F.;Reinikainen T.
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
60.Low cost smart labels assembled by anisotropically conductive adhesive

机译：通过各向异性导电胶组装而成的低成本智能标签
- 作者：An Bing;Chu Hua-bin;He Jing-qiang;Wang Jia;Hua Li;Wu Feng-Shun;Wu Yi-ping
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
61.Thermal conductivity of isotropic conductive adhesives composed of an epoxy-based binder

机译：由环氧基粘合剂组成的各向同性导电胶的导热系数
- 作者：Inoue M.;Muta H.;Maekawa T.;Yamanaka S.;Suganuma K.
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
62.The microstructure of eutectic Au-Sn and In-Sn solders on Au/Ti and Au/Ni metallizations during laser solder bonding process for optical fiber alignment

机译：光纤对准激光焊接过程中Au / Ti和Au / Ni镀层上共晶Au-Sn和In-Sn焊料的微观结构
- 作者：Yan Bohan;Wang Chunqing;Zhang Wei
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
63.Curvature-compensated CMOS bandgap reference with 1.8-V operation

机译：具有1.8V工作电压的曲率补偿CMOS带隙基准
- 作者：Wang Xichuan;Si Cuiying;Xu Xing
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》
64.Analysis of mechanical strength for flip-chip bonding of GaAs MMIC

机译：GaAs MMIC倒装芯片键合的机械强度分析
- 作者：Bo Zhang;Murugesan V.;Billstrom N.;Stenquist P.;Johan Liu
- 会议名称：《High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Conference on》